CONDUCTIVE LAMINATE

To provide a conductive laminate having excellent interlayer adhesion.SOLUTION: The present invention provides a conductive laminate comprising a polycarbonate substrate, on at least one side of which, an undercoat layer, a conductive layer comprising silver nanoparticles, and a copper plated layer...

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Bibliographische Detailangaben
1. Verfasser:	IIZAKA HIROFUMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a conductive laminate having excellent interlayer adhesion.SOLUTION: The present invention provides a conductive laminate comprising a polycarbonate substrate, on at least one side of which, an undercoat layer, a conductive layer comprising silver nanoparticles, and a copper plated layer are laminated. The undercoat layer comprises polyvinyl butyral and (3-mercaptopropyl) trimethoxysilane, and the weight ratio of polyvinyl butyral/(3-mercaptopropyl) trimethoxysilane is 95/5-60/40.SELECTED DRAWING: Figure 7 【課題】本開示の目的は、層間の密着性に優れる導電性積層体を提供することである。【解決手段】本実施形態の一つは、ポリカーボネート基材の少なくとも一方の面上にアンダーコート層、銀ナノ粒子から形成される導電層、及び銅めっき層が積層された導電性積層体であって、前記アンダーコート層は、ポリビニルブチラール及び（３－メルカプトプロピル）トリメトキシシランを含み、前記ポリビニルブチラール／前記（３－メルカプトプロピル）トリメトキシシランの重量比が９５／５～６０／４０である、導電性積層体である。【選択図】図７