CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

To provide a conductive film or an anisotropic conductive film which suppresses occurrence of short circuit by suppressing movement of conductive particles accompanying a resin flow, and can enhance reliability of the connection structure, in conductive connection or anisotropic conductive connection.SOLUTION: An anisotropic conductive film 100 has an insulation resin layer in which a first resin layer 10, a second resin layer 20, and a third resin layer 30 are laminated in this order. Lowest melting viscosity of each layer is higher in the order of the second resin layer 20, the first resin layer 10, and the third resin layer 30. A plurality of conductive particles 40 are dispersed in the insulation resin layer, and is held by at least the first resin layer 10 and the second resin layer 20. When thickness of the first resin layer 10 is represented by Tt, thickness of the second resin layer 20 is represented by Tc, and an average particle diameter of the conductive particles 40 is represented by D, the conductive film 100 satisfies the expression of expression (1).SELECTED DRAWING: Figure 1 【課題】導電接続もしくは異方性導電接続の際に、樹脂流動に伴う導電粒子の移動を抑制することによってショートの発生を抑制し、接続構造体の信頼性を高めることが可能な導電フィルムもしくは異方性導電フィルムを提供する。【解決手段】異方性導電フィルム１００は、第１樹脂層１０と、第２樹脂層２０と、第３樹脂層３０とがこの順に積層された絶縁樹脂層を有する。各層の最低溶融粘度は、第２樹脂層２０、第１樹脂層１０、第３樹脂層３０の順に高い。複数の導電粒子４０は、絶縁樹脂層中に分散され、少なくとも、第１樹脂層１０及び第２樹脂層２０によって保持されている。導電フィルム１００は、第１樹脂層１０の厚みをＴｔ、第２樹脂層２０の厚みをＴｃ、導電粒子４０の平均粒子径をＤとしたとき、式（１）：【数１】TIFF2023051504000011.tif5170の関係を満たす。【選択図】図１