FILM DEPOSITION APPARATUS
To provide a film deposition apparatus capable of suppressing an electronic component from being electrically charged when a protective sheet is peeled off from a cooling plate.SOLUTION: A film deposition apparatus comprises a film deposition processing part which deposits films on electronic compon...
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| creator | NISHIGAKI HISASHI |
| description | To provide a film deposition apparatus capable of suppressing an electronic component from being electrically charged when a protective sheet is peeled off from a cooling plate.SOLUTION: A film deposition apparatus comprises a film deposition processing part which deposits films on electronic components 60 on a protective sheet brought into contact with a cooling plate 63, and a plate release part 4 which detaches the cooling plate 63, wherein the cooling plate 63 has penetrating air holes formed within a range including a region where the electronic components 60 are arrayed, and the plate release part 4 has a mount table 42 having positive pressure generation holes, a ceiling part 41 which presses a part of the protective sheet apart from the region where the electronic components 60 are arrayed while the mount table 42 is pressing the region where the electronic components 60 are arrayed through the positive-pressure generation holes, and releases the protective sheet from being pressed after the region where the electronic components 60 are arrayed separates from the cooling plate 63, and a grounding part 41a which directly grounds the ceiling part 41.SELECTED DRAWING: Figure 12
【課題】冷却プレートから保護シートを剥がす際の電子部品の帯電を抑制できる成膜装置を提供する。【解決手段】実施形態の成膜装置は、冷却プレート６３に密着させた保護シート上の電子部品６０に対して成膜する成膜処理部と、冷却プレート６３を外すプレート解除部４と、を備え、冷却プレート６３は、電子部品６０が配列される領域を含んだ範囲に空気孔が貫設され、プレート解除部４は正圧発生孔を有する載置台４２と、載置台４２が正圧発生孔を通じて電子部品６０が配列される領域を加圧している間、保護シートのうちの電子部品６０が配列される領域から外れた箇所を押さえ付けておき、電子部品６０が配列される領域が冷却プレート６３から離れた後、押さえ付けを解除する固定部である天井部４１と、天井部４１を直接接地する接地部４１ａと、を有する。【選択図】図１２ |
| format | Patent |
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【課題】冷却プレートから保護シートを剥がす際の電子部品の帯電を抑制できる成膜装置を提供する。【解決手段】実施形態の成膜装置は、冷却プレート６３に密着させた保護シート上の電子部品６０に対して成膜する成膜処理部と、冷却プレート６３を外すプレート解除部４と、を備え、冷却プレート６３は、電子部品６０が配列される領域を含んだ範囲に空気孔が貫設され、プレート解除部４は正圧発生孔を有する載置台４２と、載置台４２が正圧発生孔を通じて電子部品６０が配列される領域を加圧している間、保護シートのうちの電子部品６０が配列される領域から外れた箇所を押さえ付けておき、電子部品６０が配列される領域が冷却プレート６３から離れた後、押さえ付けを解除する固定部である天井部４１と、天井部４１を直接接地する接地部４１ａと、を有する。【選択図】図１２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230411&DB=EPODOC&CC=JP&NR=2023050875A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230411&DB=EPODOC&CC=JP&NR=2023050875A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NISHIGAKI HISASHI</creatorcontrib><title>FILM DEPOSITION APPARATUS</title><description>To provide a film deposition apparatus capable of suppressing an electronic component from being electrically charged when a protective sheet is peeled off from a cooling plate.SOLUTION: A film deposition apparatus comprises a film deposition processing part which deposits films on electronic components 60 on a protective sheet brought into contact with a cooling plate 63, and a plate release part 4 which detaches the cooling plate 63, wherein the cooling plate 63 has penetrating air holes formed within a range including a region where the electronic components 60 are arrayed, and the plate release part 4 has a mount table 42 having positive pressure generation holes, a ceiling part 41 which presses a part of the protective sheet apart from the region where the electronic components 60 are arrayed while the mount table 42 is pressing the region where the electronic components 60 are arrayed through the positive-pressure generation holes, and releases the protective sheet from being pressed after the region where the electronic components 60 are arrayed separates from the cooling plate 63, and a grounding part 41a which directly grounds the ceiling part 41.SELECTED DRAWING: Figure 12
【課題】冷却プレートから保護シートを剥がす際の電子部品の帯電を抑制できる成膜装置を提供する。【解決手段】実施形態の成膜装置は、冷却プレート６３に密着させた保護シート上の電子部品６０に対して成膜する成膜処理部と、冷却プレート６３を外すプレート解除部４と、を備え、冷却プレート６３は、電子部品６０が配列される領域を含んだ範囲に空気孔が貫設され、プレート解除部４は正圧発生孔を有する載置台４２と、載置台４２が正圧発生孔を通じて電子部品６０が配列される領域を加圧している間、保護シートのうちの電子部品６０が配列される領域から外れた箇所を押さえ付けておき、電子部品６０が配列される領域が冷却プレート６３から離れた後、押さえ付けを解除する固定部である天井部４１と、天井部４１を直接接地する接地部４１ａと、を有する。【選択図】図１２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB08_TxVXBxDfAP9gzx9PdTcAwIcAxyDAkN5mFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgZGxgamBhbmpo7GRCkCAFxVIIs</recordid><startdate>20230411</startdate><enddate>20230411</enddate><creator>NISHIGAKI HISASHI</creator><scope>EVB</scope></search><sort><creationdate>20230411</creationdate><title>FILM DEPOSITION APPARATUS</title><author>NISHIGAKI HISASHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023050875A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>NISHIGAKI HISASHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NISHIGAKI HISASHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FILM DEPOSITION APPARATUS</title><date>2023-04-11</date><risdate>2023</risdate><abstract>To provide a film deposition apparatus capable of suppressing an electronic component from being electrically charged when a protective sheet is peeled off from a cooling plate.SOLUTION: A film deposition apparatus comprises a film deposition processing part which deposits films on electronic components 60 on a protective sheet brought into contact with a cooling plate 63, and a plate release part 4 which detaches the cooling plate 63, wherein the cooling plate 63 has penetrating air holes formed within a range including a region where the electronic components 60 are arrayed, and the plate release part 4 has a mount table 42 having positive pressure generation holes, a ceiling part 41 which presses a part of the protective sheet apart from the region where the electronic components 60 are arrayed while the mount table 42 is pressing the region where the electronic components 60 are arrayed through the positive-pressure generation holes, and releases the protective sheet from being pressed after the region where the electronic components 60 are arrayed separates from the cooling plate 63, and a grounding part 41a which directly grounds the ceiling part 41.SELECTED DRAWING: Figure 12
【課題】冷却プレートから保護シートを剥がす際の電子部品の帯電を抑制できる成膜装置を提供する。【解決手段】実施形態の成膜装置は、冷却プレート６３に密着させた保護シート上の電子部品６０に対して成膜する成膜処理部と、冷却プレート６３を外すプレート解除部４と、を備え、冷却プレート６３は、電子部品６０が配列される領域を含んだ範囲に空気孔が貫設され、プレート解除部４は正圧発生孔を有する載置台４２と、載置台４２が正圧発生孔を通じて電子部品６０が配列される領域を加圧している間、保護シートのうちの電子部品６０が配列される領域から外れた箇所を押さえ付けておき、電子部品６０が配列される領域が冷却プレート６３から離れた後、押さえ付けを解除する固定部である天井部４１と、天井部４１を直接接地する接地部４１ａと、を有する。【選択図】図１２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | FILM DEPOSITION APPARATUS |
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