FILM DEPOSITION APPARATUS

To provide a film deposition apparatus capable of suppressing an electronic component from being electrically charged when a protective sheet is peeled off from a cooling plate.SOLUTION: A film deposition apparatus comprises a film deposition processing part which deposits films on electronic compon...

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1. Verfasser: NISHIGAKI HISASHI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a film deposition apparatus capable of suppressing an electronic component from being electrically charged when a protective sheet is peeled off from a cooling plate.SOLUTION: A film deposition apparatus comprises a film deposition processing part which deposits films on electronic components 60 on a protective sheet brought into contact with a cooling plate 63, and a plate release part 4 which detaches the cooling plate 63, wherein the cooling plate 63 has penetrating air holes formed within a range including a region where the electronic components 60 are arrayed, and the plate release part 4 has a mount table 42 having positive pressure generation holes, a ceiling part 41 which presses a part of the protective sheet apart from the region where the electronic components 60 are arrayed while the mount table 42 is pressing the region where the electronic components 60 are arrayed through the positive-pressure generation holes, and releases the protective sheet from being pressed after the region where the electronic components 60 are arrayed separates from the cooling plate 63, and a grounding part 41a which directly grounds the ceiling part 41.SELECTED DRAWING: Figure 12 【課題】冷却プレートから保護シートを剥がす際の電子部品の帯電を抑制できる成膜装置を提供する。【解決手段】実施形態の成膜装置は、冷却プレート63に密着させた保護シート上の電子部品60に対して成膜する成膜処理部と、冷却プレート63を外すプレート解除部4と、を備え、冷却プレート63は、電子部品60が配列される領域を含んだ範囲に空気孔が貫設され、プレート解除部4は正圧発生孔を有する載置台42と、載置台42が正圧発生孔を通じて電子部品60が配列される領域を加圧している間、保護シートのうちの電子部品60が配列される領域から外れた箇所を押さえ付けておき、電子部品60が配列される領域が冷却プレート63から離れた後、押さえ付けを解除する固定部である天井部41と、天井部41を直接接地する接地部41aと、を有する。【選択図】図12