COIL COMPONENT AND COIL MODULE
To improve a coil component including a coil pattern provided on a substrate and a magnetic material layer covering the substrate.SOLUTION: A coil component 1 includes a substrate 10, a coil pattern 30 provided on one surface 11 of the substrate 10, and a magnetic material layer 20 covering the othe...
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| creator | MIYAO YOSUKE HIRAKI MAKOTO KAJIKIYA SHOMA |
| description | To improve a coil component including a coil pattern provided on a substrate and a magnetic material layer covering the substrate.SOLUTION: A coil component 1 includes a substrate 10, a coil pattern 30 provided on one surface 11 of the substrate 10, and a magnetic material layer 20 covering the other surface 12 of the substrate 10. A laminated body S of the substrate 10 and the magnetic material layer 20 has a through-hole 40 provided on an open area 31a of the coil pattern 30. On this same basis, even if electronic components such as IC modules are arranged in the through-hole 40, there is no interference between the electronic components and the substrate 10.SELECTED DRAWING: Figure 1
【課題】基材に設けられたコイルパターン及び基材を覆う磁性体層を備えるコイル部品を改良する。【解決手段】コイル部品１は、基材１０と、基材１０の一方の表面１１に設けられたコイルパターン３０と、基材１０の他方の表面１２を覆う磁性体層２０とを備える。基材１０と磁性体層２０の積層体Ｓは、コイルパターン３０の開口領域３１ａに設けられた貫通孔４０を有する。これによれば、貫通孔４０内にＩＣモジュールなどの電子部品を配置しても、電子部品と基材１０が干渉することがない。【選択図】図１ |
| format | Patent |
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【課題】基材に設けられたコイルパターン及び基材を覆う磁性体層を備えるコイル部品を改良する。【解決手段】コイル部品１は、基材１０と、基材１０の一方の表面１１に設けられたコイルパターン３０と、基材１０の他方の表面１２を覆う磁性体層２０とを備える。基材１０と磁性体層２０の積層体Ｓは、コイルパターン３０の開口領域３１ａに設けられた貫通孔４０を有する。これによれば、貫通孔４０内にＩＣモジュールなどの電子部品を配置しても、電子部品と基材１０が干渉することがない。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRICITY ; INDUCTANCES ; MAGNETS ; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ; TRANSFORMERS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230410&DB=EPODOC&CC=JP&NR=2023049131A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230410&DB=EPODOC&CC=JP&NR=2023049131A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIYAO YOSUKE</creatorcontrib><creatorcontrib>HIRAKI MAKOTO</creatorcontrib><creatorcontrib>KAJIKIYA SHOMA</creatorcontrib><title>COIL COMPONENT AND COIL MODULE</title><description>To improve a coil component including a coil pattern provided on a substrate and a magnetic material layer covering the substrate.SOLUTION: A coil component 1 includes a substrate 10, a coil pattern 30 provided on one surface 11 of the substrate 10, and a magnetic material layer 20 covering the other surface 12 of the substrate 10. A laminated body S of the substrate 10 and the magnetic material layer 20 has a through-hole 40 provided on an open area 31a of the coil pattern 30. On this same basis, even if electronic components such as IC modules are arranged in the through-hole 40, there is no interference between the electronic components and the substrate 10.SELECTED DRAWING: Figure 1
【課題】基材に設けられたコイルパターン及び基材を覆う磁性体層を備えるコイル部品を改良する。【解決手段】コイル部品１は、基材１０と、基材１０の一方の表面１１に設けられたコイルパターン３０と、基材１０の他方の表面１２を覆う磁性体層２０とを備える。基材１０と磁性体層２０の積層体Ｓは、コイルパターン３０の開口領域３１ａに設けられた貫通孔４０を有する。これによれば、貫通孔４０内にＩＣモジュールなどの電子部品を配置しても、電子部品と基材１０が干渉することがない。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRICITY</subject><subject>INDUCTANCES</subject><subject>MAGNETS</subject><subject>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</subject><subject>TRANSFORMERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBz9vf0UXD29w3w93P1C1Fw9HNRAAv5-ruE-rjyMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAyNjAxNLQ2NDR2OiFAEA3LchhQ</recordid><startdate>20230410</startdate><enddate>20230410</enddate><creator>MIYAO YOSUKE</creator><creator>HIRAKI MAKOTO</creator><creator>KAJIKIYA SHOMA</creator><scope>EVB</scope></search><sort><creationdate>20230410</creationdate><title>COIL COMPONENT AND COIL MODULE</title><author>MIYAO YOSUKE ; HIRAKI MAKOTO ; KAJIKIYA SHOMA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023049131A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRICITY</topic><topic>INDUCTANCES</topic><topic>MAGNETS</topic><topic>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</topic><topic>TRANSFORMERS</topic><toplevel>online_resources</toplevel><creatorcontrib>MIYAO YOSUKE</creatorcontrib><creatorcontrib>HIRAKI MAKOTO</creatorcontrib><creatorcontrib>KAJIKIYA SHOMA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIYAO YOSUKE</au><au>HIRAKI MAKOTO</au><au>KAJIKIYA SHOMA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COIL COMPONENT AND COIL MODULE</title><date>2023-04-10</date><risdate>2023</risdate><abstract>To improve a coil component including a coil pattern provided on a substrate and a magnetic material layer covering the substrate.SOLUTION: A coil component 1 includes a substrate 10, a coil pattern 30 provided on one surface 11 of the substrate 10, and a magnetic material layer 20 covering the other surface 12 of the substrate 10. A laminated body S of the substrate 10 and the magnetic material layer 20 has a through-hole 40 provided on an open area 31a of the coil pattern 30. On this same basis, even if electronic components such as IC modules are arranged in the through-hole 40, there is no interference between the electronic components and the substrate 10.SELECTED DRAWING: Figure 1
【課題】基材に設けられたコイルパターン及び基材を覆う磁性体層を備えるコイル部品を改良する。【解決手段】コイル部品１は、基材１０と、基材１０の一方の表面１１に設けられたコイルパターン３０と、基材１０の他方の表面１２を覆う磁性体層２０とを備える。基材１０と磁性体層２０の積層体Ｓは、コイルパターン３０の開口領域３１ａに設けられた貫通孔４０を有する。これによれば、貫通孔４０内にＩＣモジュールなどの電子部品を配置しても、電子部品と基材１０が干渉することがない。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; jpn |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRICITY INDUCTANCES MAGNETS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TRANSFORMERS |
| title | COIL COMPONENT AND COIL MODULE |
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