COIL COMPONENT AND COIL MODULE

To improve a coil component including a coil pattern provided on a substrate and a magnetic material layer covering the substrate.SOLUTION: A coil component 1 includes a substrate 10, a coil pattern 30 provided on one surface 11 of the substrate 10, and a magnetic material layer 20 covering the othe...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MIYAO YOSUKE, HIRAKI MAKOTO, KAJIKIYA SHOMA
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To improve a coil component including a coil pattern provided on a substrate and a magnetic material layer covering the substrate.SOLUTION: A coil component 1 includes a substrate 10, a coil pattern 30 provided on one surface 11 of the substrate 10, and a magnetic material layer 20 covering the other surface 12 of the substrate 10. A laminated body S of the substrate 10 and the magnetic material layer 20 has a through-hole 40 provided on an open area 31a of the coil pattern 30. On this same basis, even if electronic components such as IC modules are arranged in the through-hole 40, there is no interference between the electronic components and the substrate 10.SELECTED DRAWING: Figure 1 【課題】基材に設けられたコイルパターン及び基材を覆う磁性体層を備えるコイル部品を改良する。【解決手段】コイル部品1は、基材10と、基材10の一方の表面11に設けられたコイルパターン30と、基材10の他方の表面12を覆う磁性体層20とを備える。基材10と磁性体層20の積層体Sは、コイルパターン30の開口領域31aに設けられた貫通孔40を有する。これによれば、貫通孔40内にICモジュールなどの電子部品を配置しても、電子部品と基材10が干渉することがない。【選択図】図1