COMPOUND, MOLDING, AND CURED PRODUCT OF COMPOUND
To provide a compound that can form a molding having excellent insulation properties, a molding formed from the compound, and a cured product of the compound.SOLUTION: A compound according to one aspect of the present invention contains magnetic powder, and a resin composition containing an epoxy re...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a compound that can form a molding having excellent insulation properties, a molding formed from the compound, and a cured product of the compound.SOLUTION: A compound according to one aspect of the present invention contains magnetic powder, and a resin composition containing an epoxy resin, a curing agent, and a coupling agent, the coupling agent containing a polyfunctional silane compound with kinematic viscosity of 10-2000 mm2/s at 25°C and a titanate compound.SELECTED DRAWING: None
【課題】絶縁特性に優れる成形体を形成することができるコンパウンド、該コンパウンドを用いた成形体、及びコンパウンドの硬化物が提供すること。【解決手段】本発明の一側面に係るコンパウンドは、磁性粉と、エポキシ樹脂、硬化剤、及びカップリング剤を含有する樹脂組成物と、を備え、前記カップリング剤が、25℃での動粘度が10~2000mm2/sである多官能シラン化合物と、チタネート化合物とを含む。【選択図】なし |
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