LAMINATE AND PACKAGING CONTAINER

To provide a laminate having good heat seal strength and a reduced solvent odor, which is a laminate comprising a base material composed of polyethylene and a heat seal layer.SOLUTION: There is provided a laminate comprising a base material and a heat seal layer, wherein the base material is a polye...

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA KENICHI, KONO SHINICHIRO, SUDA TORU, ISHIKAWA SHUN, TAKASUGI YUYA, YAMAZOE HIROKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a laminate having good heat seal strength and a reduced solvent odor, which is a laminate comprising a base material composed of polyethylene and a heat seal layer.SOLUTION: There is provided a laminate comprising a base material and a heat seal layer, wherein the base material is a polyethylene base material obtained by stretching treatment, the heat seal layer has at least a first layer and a second layer, the first layer contains an ethylene-α-olefin copolymer and has a melting point of 112°C or less, the second layer contains polyethylene and has a melting point of 114°C or more, a surface layer on one side of the laminate is a first layer of the heat seal layer, the base material and the heat seal layer are laminated via an adhesive layer and the adhesive layer comprises a solvent-free adhesive.SELECTED DRAWING: Figure 1 【課題】ポリエチレンから構成される基材とヒートシール層とを備える積層体であって、ヒートシール強度が良好で、且つ溶剤臭が低減された積層体を提供する。【解決手段】基材とヒートシール層とを備える積層体であって、基材は、延伸処理されてなるポリエチレン基材であり、ヒートシール層は、第１の層と、第２の層とを少なくとも備え、第１の層が、エチレン－α－オレフィン共重合体を含有し、第１の層の融点が、１１２℃以下であり、第２の層が、ポリエチレンを含有し、第２の層の融点が、１１４℃以上であり、積層体の一方側の表層が、ヒートシール層の第１の層であり、基材とヒートシール層とが接着剤層を介して積層されており、接着剤層が、無溶剤型接着剤からなる、積層体とする。【選択図】図１