METHOD FOR MANUFACTURING WIRING BOARD AND WIRING BOARD

To provide a method for manufacturing a wiring board, the method enabling formation of a fine metal pattern having high adhesibility, and a wiring board having high adhesibility of the metal pattern.SOLUTION: A method for manufacturing a wiring board is provided, including the steps of: forming a re...

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Hauptverfasser:	UCHIYAMA KATSUHIRO, SHIHO KOUJI, MITSUDA KAZUHIRO, YASU KATSUHIKO, TAKAHASHI YUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY CINEMATOGRAPHY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide a method for manufacturing a wiring board, the method enabling formation of a fine metal pattern having high adhesibility, and a wiring board having high adhesibility of the metal pattern.SOLUTION: A method for manufacturing a wiring board is provided, including the steps of: forming a resin pattern on a board; applying a surface treatment agent including a compound α to the board on which the resin pattern has been formed; and forming a metal pattern by plating processing on the board to which the surface treatment agent has been applied. The compound α has a first functional group capable of reacting and binding with the board and a second functional group capable of reacting and binding with the metal.SELECTED DRAWING: Figure 1f 【課題】密着性が高く、微細な金属パターンを形成することができる配線基板の製造方法、及び金属パターンの密着性が高い配線基板を提供する。【解決手段】本発明の一形態は、基板上に樹脂パターンを形成する工程、上記樹脂パターンが形成された基板上に、化合物αを含む表面処理剤を塗布する工程、及び上記表面処理剤が塗布された基板上に、めっき処理により金属パターンを形成する工程を備え、上記化合物αが、上記基板と反応して結合することが可能な第１官能基と、金属と反応して結合することが可能な第２官能基とを有する、配線基板の製造方法である。【選択図】図１ｆ