THERMALLY CONDUCTIVE SHEET

To provide a thermally conductive sheet having high adhesive strength, low thermal resistance, and high reworkability.SOLUTION: A thermally conductive sheet includes at least: a first thermally conductive layer containing an acrylic copolymer having a Tg (glass transition temperature) of less than 0...

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1. Verfasser:	YOSHIKI TAKENOBU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide a thermally conductive sheet having high adhesive strength, low thermal resistance, and high reworkability.SOLUTION: A thermally conductive sheet includes at least: a first thermally conductive layer containing an acrylic copolymer having a Tg (glass transition temperature) of less than 0°C, an acrylic copolymer having a Tg of 0°C or more and a thermally conductive filler; and a second thermally conductive layer containing an acrylic copolymer, wherein a ratio of a thermally conductive filler in the first thermally conductive layer is 30 vol.% or more, and the total thickness of the first and second thermally conductive layers is less than 25 μm.SELECTED DRAWING: Figure 1 【課題】高い粘着力を有し、熱抵抗が低く、かつリワーク性の高い熱伝導性シートを提供する。【解決手段】Ｔｇ（ガラス転移温度）が０℃未満のアクリル共重合体、Ｔｇが０℃以上のアクリル共重合体、および熱伝導性フィラーを含有する第一の熱伝導層と、アクリル共重合体を含有する第二の熱伝導層を少なくとも有し、該第一の熱伝導層における熱伝導性フィラーが占める割合が３０体積％以上であり、該第一の熱伝導層と該第二の熱伝導層の厚みの合計が２５μｍ以下である熱伝導性シート。【選択図】図１