WIRING BOARD UNIT AND METHOD FOR MANUFACTURING WIRING BOARD

To provide a wiring board and a method for manufacturing the wiring board in which the wiring board is resistant to warping during heating and stress inside the wiring layer in the method for forming a fine wiring layer on a support substrate, mounting this layer on a wiring board for FC-BGA, and mo...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TANABE RYOMA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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