WIRING BOARD UNIT AND METHOD FOR MANUFACTURING WIRING BOARD

To provide a wiring board and a method for manufacturing the wiring board in which the wiring board is resistant to warping during heating and stress inside the wiring layer in the method for forming a fine wiring layer on a support substrate, mounting this layer on a wiring board for FC-BGA, and mo...

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1. Verfasser:	TANABE RYOMA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a wiring board and a method for manufacturing the wiring board in which the wiring board is resistant to warping during heating and stress inside the wiring layer in the method for forming a fine wiring layer on a support substrate, mounting this layer on a wiring board for FC-BGA, and mounting semiconductor chips on the fine wiring.SOLUTION: A wiring board has a second wiring board with finer wiring than the first wiring board and bonded to the first wiring board, in which a semiconductor element is mounted on the opposite side of the bonded surface of the second wiring board to the first wiring board, and there is a reinforcement layer on the outermost layer of the side of the second wiring board where the semiconductor element is mounted.SELECTED DRAWING: Figure 9A 【課題】支持基板の上に微細な配線層を形成し、これをＦＣ－ＢＧＡ用配線基板に搭載し、微細な配線上に半導体チップを搭載する方式において、加熱時の反りや、配線層内部の応力に対して耐性のある配線基板及び配線基板の製造方法を提供する。【解決手段】第１配線基板に接合された第１配線基板より微細な配線が形成された第２配線基板と、を備え、第２配線基板の前記第１配線基板との接合面の対向面に半導体素子が実装される配線基板において、第２配線基板の半導体素子が実装される側の最外層に補強層があることを特徴とする配線基板。【選択図】図９Ａ