EVALUATION TOOL AND METHOD FOR ATTACHING EVALUATION TOOL

To securely attach a semiconductor device without any damage.SOLUTION: A bottom plate 30 is plate-like, and has a top surface large in area enough to overlap with a cooling bottom plate of a cooling device 20, which is arranged on the top surface. A frame part 40 surrounds the four sides of the cool...

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1. Verfasser:	UCHIMI REIKA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Zusammenfassung:	To securely attach a semiconductor device without any damage.SOLUTION: A bottom plate 30 is plate-like, and has a top surface large in area enough to overlap with a cooling bottom plate of a cooling device 20, which is arranged on the top surface. A frame part 40 surrounds the four sides of the cooling device 20 in plan view together with the four sides of the bottom plate 30. Consequently, a semiconductor device 2 is securely attached to an evaluation tool 3. Consequently, the semiconductor device 2 is suppressed from rattling on the evaluation tool 3 to be prevented from being damaged by the evaluation tool 3. The evaluation tool 3 can be thereby securely attached without damaging the semiconductor device 2.SELECTED DRAWING: Figure 2 【課題】半導体装置が損傷を受けることなく、確実に取り付けられる。【解決手段】底板３０は、平板状であって、おもて面が冷却装置２０の冷却底板と重複する面積を成し、冷却装置２０がおもて面に配置される。枠部４０は、平面視で冷却装置２０の四方を底板３０の四方と共にそれぞれ取り囲む。これにより、半導体装置２は評価治具３に対して堅固に取り付けられる。このため、半導体装置２は評価治具３に対して、がたつきの発生が抑制され、評価治具３による損傷の発生を防止することができる。このため、半導体装置２が損傷を受けることなく、評価治具３が確実に取り付けられる。【選択図】図２