SUBSTRATE PROCESSING DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM

To provide a technology for detecting the state of substrate placing surfaces.SOLUTION: A substrate processing device has: a processing chamber where deposition processing of substrates is carried out; a substrate supporting part provided in the processing chamber, and having a plurality of placing...

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Bibliographische Detailangaben
Hauptverfasser:	OHASHI TADASHI, ITAYA HIDEJI, KOSUMAKI TOSHIAKI, MATSUI SHUN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide a technology for detecting the state of substrate placing surfaces.SOLUTION: A substrate processing device has: a processing chamber where deposition processing of substrates is carried out; a substrate supporting part provided in the processing chamber, and having a plurality of placing surfaces for placing the substrates; and a detecting part arranged outside or inside the processing chamber to detect the state of a deposition material adhered to the placing surfaces in a non-contact manner.SELECTED DRAWING: Figure 4 【課題】基板の載置面の状態を検出する技術を提供する。【解決手段】基板処理装置は、基板を成膜処理する処理室と、前記処理室内に設けられ、かつ、前記基板が載置される複数の載置面を有する基板支持部と、前記処理室の外側又は内側に配置され、前記載置面に付着する成膜材料の状態を非接触で検出する検出部と、を有する。【選択図】図４