SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

To improve reliability of a semiconductor device covering an uppermost layer wiring of a multilayer wiring layer with a passivation film.SOLUTION: A semiconductor device manufacturing method forms a semiconductor device including a first wiring WR1, a second wiring WR2, dummy wirings D1 and D2, and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MORI TAKAHIRO, KOSHIMIZU AKIRA, MURAYAMA TOMOKI, SAKAI JUNJIRO, IIDA SATOSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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