SUBSTRATE MOUNTING STRUCTURE

To provide a substrate mounting structure having a simple structure and excellent heat resistance performance.SOLUTION: A substrate mounting structure includes a first substrate 26a and a second substrate 26b on which electronic components are mounted, and a spacer substrate 26c provided between the first substrate 26a and the second substrate 26b, and the spacer substrate 26c includes a plurality of regions A provided via a partition 33 such that the relative distance changes on the basis of external force acting along the planar direction of the spacer substrate 26c. In each of a plurality of regions A, bar-shaped relay terminals 30 for electrically connecting a soldered portion of the first substrate 26a and a soldered portion of the second substrate 26b are distributed in a penetrating state.SELECTED DRAWING: Figure 7 【課題】構造が簡単で耐熱性能に優れたな基板搭載構造を提供する。【解決手段】電子部品が実装された第１基板２６ａおよび第２基板２６ｂと、これら第１基板２６ａおよび第２基板２６ｂの間に設けられるスペーサ基板２６ｃとを有し、スペーサ基板２６ｃが、スペーサ基板２６ｃの平面方向に沿って作用する外力に基づいて相対距離が変化するよう仕切部３３を介して設けられた複数の領域Ａを備えており、複数の領域Ａの夫々に、第１基板２６ａのはんだ付け部と第２基板２６ｂのはんだ付け部とを電気的に接続する棒状の中継端子３０が貫通した状態で分散配置してある基板搭載構造。【選択図】図７