CURABLE RESIN COMPOSITION

To provide a curable resin composition which enables production of a uniform cured product, and satisfies all of a sufficient Tg, low dielectric characteristics and a low coefficient linear expansion of the cured product.SOLUTION: A curable resin composition contains (A) modified polyphenylene ether represented by the following formula (1), and a styrenic elastomer. In formula (1), Z is an a-valent partial structure, a represents an integer of 2 to 6, Y is each independently a divalent connection group having a structure represented by the following formula (4), n represents a repeated number of Y and is each independently an integer of 0-200, at least one n in a pieces of [-Yn-A] is an integer of 1 or more, and A represents a hydrogen atom or a silyl group-containing derivative bondable to a polyphenylene ether structure excluding the case of all the hydrogen atoms.SELECTED DRAWING: None 【課題】均一な硬化物が得られ、硬化物の十分なＴｇ、低誘電特性、及び低線膨張係数の全てを満足させる硬化性樹脂組成物を提供すること。【解決手段】下記式（１）で表される（Ａ）変性ポリフェニレンエーテル及び（Ｂ）スチレン系エラストマーを含む、硬化性樹脂組成物。TIFF2023034824000040.tif1678｛式（１）中、Ｚはａ価の部分構造であり、ａは２～６の整数を表し、Ｙは、各々独立に、下記式（４）で表される構造を有する２価の連結基であり、ｎは、Ｙの繰り返し数を表し、各々独立に、０～２００の整数であり、ａ個の［－Ｙｎ－Ａ］中の少なくとも１つのｎは、１以上の整数であり、Ａは、全て水素原子の場合を除いて、水素原子、又はポリフェニレンエーテル構造と結合可能なシリル基含有誘導体を表す。｝【選択図】なし