EPOXY RESIN COMPOSITION AND PREPREG

To provide a resin composition which is excellent in light resistance, and a prepreg which is excellent in light resistance and handleability at room temperatures and has less resin flow when cured-molded.SOLUTION: A resin composition is provided, having the following constitution element [A], [B] a...

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Bibliographische Detailangaben
Hauptverfasser:	IKEDA HIROKI, TAKEDA ICHIRO, MACHIDA GIMPEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a resin composition which is excellent in light resistance, and a prepreg which is excellent in light resistance and handleability at room temperatures and has less resin flow when cured-molded.SOLUTION: A resin composition is provided, having the following constitution element [A], [B] and [C], wherein the [A] is composed of one or two or more kinds of non-aromatic epoxy resins and has a number average molecular weight of 550-800 g/mol, and [C] has the number average molecular weight of 16,000-28,000 g/mon. [A] epoxy resin, [B] curing agent, and [C] non-aromatic thermoplastic resin.SELECTED DRAWING: None 【課題】本発明では、耐光性に優れた樹脂組成物であり、耐光性および室温における取り扱い性に優れ、硬化成形時の樹脂フローが少ないプリプレグを提供することを課題とする。【解決手段】上記課題を解決するために、本発明は、次の構成を有する樹脂組成物を提供する。構成要素［Ａ］、［Ｂ］、［Ｃ］を含み、［Ａ］は、非芳香族エポキシ樹脂一種または二種以上から成り、数平均分子量が５５０－８００ｇ／ｍｏｌであり、［Ｃ］は、数平均分子量が１６０００－２８０００ｇ／ｍｏｌである、エポキシ樹脂組成物。［Ａ］エポキシ樹脂［Ｂ］硬化剤［Ｃ］非芳香族熱可塑性樹脂【選択図】なし