FILLER GRANULATED SUBSTANCE FOR ENGINEERING RESIN

To provide a filler granulated substance which can improve supply stability and supply accuracy of a filler when a resin composition is prepared, and can stably obtain a resin composition with high productivity.SOLUTION: A filler granulated substance for an engineering resin includes a filler and a...

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Bibliographische Detailangaben
Hauptverfasser:	MIYAMOTO AKIRA, KITANI MAKOTO, MATSUMOTO RISA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a filler granulated substance which can improve supply stability and supply accuracy of a filler when a resin composition is prepared, and can stably obtain a resin composition with high productivity.SOLUTION: A filler granulated substance for an engineering resin includes a filler and a binder, wherein bulk density of the filler is 0.01-1 kg/L, the binder contains a resin having a heating weight reduction initiation temperature of 300°C or higher, and a content ratio of the filler is 80-99.9 pts.wt. with respect to 100 pts.wt. of the total amount of the filler and the binder.SELECTED DRAWING: None 【課題】樹脂組成物を調製する際のフィラーの供給安定性および供給精度を向上させ得、高い生産性で安定的に樹脂組成物を得ることを可能とするフィラー造粒物を提供すること。【解決手段】本発明のエンジニアリング樹脂用フィラー造粒物は、フィラーと、結着剤とを含み、該フィラーの嵩密度が、０．０１ｋｇ／Ｌ～１ｋｇ／Ｌであり、該結着剤が、加熱重量減少開始温度が３００℃以上である樹脂を含み、該フィラーの含有割合が、該フィラーおよび該結着剤の合計量１００重量部に対して、８０重量部～９９．９重量部である。【選択図】なし