MANUFACTURING METHOD OF PHOTODETECTION DEVICE, INSPECTION METHOD FOR PHOTOSENSOR CHIP, AND CIRCUIT BOARD

To provide a manufacturing method of a photodetection device capable of reducing noise when inspecting a photosensor chip, an inspection method of the photosensor chip, and a circuit board.SOLUTION: A manufacturing method of a photodetection device includes the steps of: forming a plurality of photosensor chips from a wafer; inspecting a first photosensor chip among the plurality of photosensor chips using a circuit board; and connecting a second photosensor chip among the plurality of photosensor chips with a readout circuit board. The first photosensor chip comprises a plurality of pixels and the circuit board comprises an external terminal and a connection terminal connected to the external terminal and connected to a first pixel in a part of the plurality of pixels. The step of inspecting the first photosensor chip includes the steps of: connecting the circuit board to the first photosensor chip; performing an inspection using the first pixel through the circuit board; and determining a quality of the second photosensor chip on the basis of a result of the inspection using the first pixel.SELECTED DRAWING: Figure 3 【課題】光センサチップの検査の際のノイズを低減できる光検出装置の製造方法、光センサチップの検査方法及び回路基板を提供する。【解決手段】光検出装置の製造方法は、ウェハから複数の光センサチップを形成する工程と、回路基板を用いて前記複数の光センサチップのうちの第１光センサチップの検査を行う工程と、前記複数の光センサチップのうちの第２光センサチップと読み出し回路基板とを接続する工程と、を有し、前記第１光センサチップは複数の画素を備え、前記回路基板は、外部端子と、前記外部端子に接続され、かつ前記複数の画素のうちの一部の第１画素に接続される接続端子と、を有し、前記第１光センサチップの検査を行う工程は、前記第１光センサチップに前記回路基板を接続する工程と、前記回路基板を通じて前記第１画素を用いた検査を行う工程と、前記第１画素を用いた検査の結果に基づいて前記第２光センサチップの良否判定を行う工程と、を有する。【選択図】図３