EPOXY RESIN COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT DEVICE

To provide an epoxy resin composition which allows the manufacture of an electronic component device excellent in electrical reliability, a cured product thereof, and an electronic component device using the epoxy resin composition.SOLUTION: The epoxy resin composition contains: an epoxy resin; a cu...

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1. Verfasser:	KANG DONGOL
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide an epoxy resin composition which allows the manufacture of an electronic component device excellent in electrical reliability, a cured product thereof, and an electronic component device using the epoxy resin composition.SOLUTION: The epoxy resin composition contains: an epoxy resin; a curing agent containing a compound having a constituent unit of formula (B1) and a constituent unit of formula (B2); an inorganic filler; and a specific hydrotalcite compound. In the formula (B1) and the formula (B2), R2-R5 each independently represent a C1-6 monovalent organic group.SELECTED DRAWING: None 【課題】電気的信頼性に優れる電子部品装置を作製可能なエポキシ樹脂組成物及びその硬化物、並びに前記エポキシ樹脂組成物を用いた電子部品装置を提供する。【解決手段】エポキシ樹脂組成物は、エポキシ樹脂と、下記式（Ｂ１）の構成単位及び式（Ｂ２）の構成単位を有する化合物を含む硬化剤と、無機充填材と、特定のハイドロタルサイト化合物を含有する。式（Ｂ１）及び式（Ｂ２）中、Ｒ２～Ｒ５は、それぞれ独立に、炭素数１～６の１価の有機基を表す。JPEG2023023486000010.jpg60146【選択図】なし