EPOXY RESIN COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT DEVICE

To provide an epoxy resin composition having excellent reflow resistance, a cured product thereof, and an electronic component device including the cured product.SOLUTION: The epoxy resin composition contains: an epoxy resin; a curing agent containing a compound having a constituent unit of formula...

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1. Verfasser:	KANG DONGOL
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide an epoxy resin composition having excellent reflow resistance, a cured product thereof, and an electronic component device including the cured product.SOLUTION: The epoxy resin composition contains: an epoxy resin; a curing agent containing a compound having a constituent unit of formula (B1) and a constituent unit of formula (B2); an inorganic filler; and a silicone compound. In the formula (B1) and the formula (B2), R2-R5 each independently represent a C1-6 monovalent organic group.SELECTED DRAWING: None 【課題】優れた耐リフロー性を有するエポキシ樹脂組成物及びその硬化物、並びに当該硬化物を含む電子部品装置を提供する。【解決手段】エポキシ樹脂組成物は、エポキシ樹脂と、下記式（Ｂ１）の構成単位及び式（Ｂ２）の構成単位を有する化合物を含む硬化剤と、無機充填材と、シリコーン化合物と、を含有する。式（Ｂ１）及び式（Ｂ２）中、Ｒ２～Ｒ５は、それぞれ独立に、炭素数１～６の１価の有機基を表す。JPEG2023023485000013.jpg56134【選択図】なし