METHOD FOR DIVIDING SUBSTRATE
To provide a method for reliably dividing a substrate by expansion of expanding tape.SOLUTION: A method includes: preparing a substrate 10 having a division starting point 15 along a predetermined dividing line, and a protective sheet 3 adhered to one side; applying an expanding tape 63 by rolling a...
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Zusammenfassung: | To provide a method for reliably dividing a substrate by expansion of expanding tape.SOLUTION: A method includes: preparing a substrate 10 having a division starting point 15 along a predetermined dividing line, and a protective sheet 3 adhered to one side; applying an expanding tape 63 by rolling a roller on another side of the substrate 10; releasing suction by a holding table 51; rolling the roller 54 in contact with the expanding tape 63 while a slight gap 514 is formed between a holding surface 513 of the holding table 51 and the protective sheet 3; expanding a crack 16 extending from the division starting point 15 by sinking the substrate 10 through the protective sheet 3 into the gap 514 starting from the division starting point 15; expanding the expanding tape 63 to widen a chip interval starting at division starting point 15. Since the crack is expanded while sinking substrate 10 through the protective sheet 3 into the gap 514, the chip interval is reliably widened.SELECTED DRAWING: Figure 5
【課題】エキスパンドテープの拡張によって確実に基板を分割できるようにする。【解決手段】分割予定ラインに沿って分割起点15が形成され一方の面に保護シート3が貼着された基板10を準備し、基板10の他方の面にローラーを転動させてエキスパンドテープ63を貼着し、保持テーブル51による吸引を解除し、保持テーブル51の保持面513と保護シート3との間にわずかな隙間514を形成した状態でローラー54をエキスパンドテープ63に接触させて転動させ、分割起点15を起点に保護シート3を介して基板10を隙間514に沈み込ませながら分割起点15から伸びるクラック16を伸長させ、エキスパンドテープ63を拡張して分割起点15を起点にチップ間隔を広げる。保護シート3を介して基板10を隙間514に沈み込ませながらクラックを伸長させるため、確実にチップ間隔を拡げることができる。【選択図】図5 |
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