CLEANING MECHANISM

To provide a novel technique for setting cleaning conditions in a workpiece cleaning mechanism.SOLUTION: There is provided a cleaning mechanism including: a holding table having a holding surface to hold a workpiece; a cleaning nozzle facing the holding table and having an injection port for injecti...

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Bibliographische Detailangaben
1. Verfasser:	YOSHII SHUNGO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a novel technique for setting cleaning conditions in a workpiece cleaning mechanism.SOLUTION: There is provided a cleaning mechanism including: a holding table having a holding surface to hold a workpiece; a cleaning nozzle facing the holding table and having an injection port for injecting a cleaning liquid; a cleaning nozzle moving unit for moving the cleaning nozzle relative to the holding surface; an input unit to which conditions including at least the number of revolution of the holding table and the movement speed of the cleaning nozzle can be freely input; and a display unit for displaying the conditions. In the cleaning mechanism, based on the conditions, a cleaning state diagram obtained by simulating the cleaning state of the holding surface is displayed on the display unit.SELECTED DRAWING: Figure 4 【課題】ワークの洗浄機構において洗浄条件を設定するための新規な技術を提案する。【解決手段】ワークを保持する保持面を有する保持テーブルと、該保持テーブルに対面し洗浄液を噴射する噴射口を有した洗浄ノズルと、該洗浄ノズルを該保持面に対して相対移動させる洗浄ノズル移動ユニットと、少なくとも該保持テーブルの回転数と、該洗浄ノズルの移動速度と、を含む条件を入力自在な入力ユニットと、該条件を表示する表示ユニットと、を備える洗浄機構であって、該条件に基づいて、該表示ユニットにて該保持面の洗浄状態をシミュレーションした洗浄状態図が表示される、洗浄機構とする。【選択図】図４