SUBSTRATE PROCESSING APPARATUS
To provide a substrate processing apparatus that suppresses pattern cleaning phenomenon and watermark occurrence while maintaining the mass productivity of the batch processing method.SOLUTION: A substrate processing apparatus 300 includes a processing tank 310 having a housing space 312 in which a...
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| creator | CHANG KYU HWAN CHOI JUN YOUNG LEE YOUNG IL KIM CHUL-GOO CHOI JUNG-BONG |
| description | To provide a substrate processing apparatus that suppresses pattern cleaning phenomenon and watermark occurrence while maintaining the mass productivity of the batch processing method.SOLUTION: A substrate processing apparatus 300 includes a processing tank 310 having a housing space 312 in which a processing solution L3 is contained to process a plurality of substrates in a liquid, and an orientation conversion member 330 that converts the posture of a substrate W immersed in the processing solution from a vertical posture to a horizontal posture. Substrates converted to the flat posture are supplied with the wetting liquid by the wetting module 350 and then processed with the liquid and dried in a single-wafer type.SELECTED DRAWING: Figure 9
【課題】バッチ式処理方法の量産性を保ちながらパターンリーニング現象やウォーターマークの発生を抑制する基板処理装置を提供する。【解決手段】基板処理装置３００は、処理液Ｌ３が収容される収容空間３１２を有して複数の基板を液処理する処理槽３１０と、処理液に浸された状態の基板Ｗの姿勢を垂直姿勢から水平姿勢に変換する姿勢変換部材３３０と、を含む。平姿勢に変換された基板は、ウェッティングモジュール３５０によりウェッティング液を供給された後、枚葉式で液処理及び乾燥処理される。【選択図】図９ |
| format | Patent |
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【課題】バッチ式処理方法の量産性を保ちながらパターンリーニング現象やウォーターマークの発生を抑制する基板処理装置を提供する。【解決手段】基板処理装置３００は、処理液Ｌ３が収容される収容空間３１２を有して複数の基板を液処理する処理槽３１０と、処理液に浸された状態の基板Ｗの姿勢を垂直姿勢から水平姿勢に変換する姿勢変換部材３３０と、を含む。平姿勢に変換された基板は、ウェッティングモジュール３５０によりウェッティング液を供給された後、枚葉式で液処理及び乾燥処理される。【選択図】図９</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230209&DB=EPODOC&CC=JP&NR=2023021055A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230209&DB=EPODOC&CC=JP&NR=2023021055A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHANG KYU HWAN</creatorcontrib><creatorcontrib>CHOI JUN YOUNG</creatorcontrib><creatorcontrib>LEE YOUNG IL</creatorcontrib><creatorcontrib>KIM CHUL-GOO</creatorcontrib><creatorcontrib>CHOI JUNG-BONG</creatorcontrib><title>SUBSTRATE PROCESSING APPARATUS</title><description>To provide a substrate processing apparatus that suppresses pattern cleaning phenomenon and watermark occurrence while maintaining the mass productivity of the batch processing method.SOLUTION: A substrate processing apparatus 300 includes a processing tank 310 having a housing space 312 in which a processing solution L3 is contained to process a plurality of substrates in a liquid, and an orientation conversion member 330 that converts the posture of a substrate W immersed in the processing solution from a vertical posture to a horizontal posture. Substrates converted to the flat posture are supplied with the wetting liquid by the wetting module 350 and then processed with the liquid and dried in a single-wafer type.SELECTED DRAWING: Figure 9
【課題】バッチ式処理方法の量産性を保ちながらパターンリーニング現象やウォーターマークの発生を抑制する基板処理装置を提供する。【解決手段】基板処理装置３００は、処理液Ｌ３が収容される収容空間３１２を有して複数の基板を液処理する処理槽３１０と、処理液に浸された状態の基板Ｗの姿勢を垂直姿勢から水平姿勢に変換する姿勢変換部材３３０と、を含む。平姿勢に変換された基板は、ウェッティングモジュール３５０によりウェッティング液を供給された後、枚葉式で液処理及び乾燥処理される。【選択図】図９</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJALDnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBvMwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDI2MDI0MDU1NHY6IUAQAX5iIM</recordid><startdate>20230209</startdate><enddate>20230209</enddate><creator>CHANG KYU HWAN</creator><creator>CHOI JUN YOUNG</creator><creator>LEE YOUNG IL</creator><creator>KIM CHUL-GOO</creator><creator>CHOI JUNG-BONG</creator><scope>EVB</scope></search><sort><creationdate>20230209</creationdate><title>SUBSTRATE PROCESSING APPARATUS</title><author>CHANG KYU HWAN ; CHOI JUN YOUNG ; LEE YOUNG IL ; KIM CHUL-GOO ; CHOI JUNG-BONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023021055A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHANG KYU HWAN</creatorcontrib><creatorcontrib>CHOI JUN YOUNG</creatorcontrib><creatorcontrib>LEE YOUNG IL</creatorcontrib><creatorcontrib>KIM CHUL-GOO</creatorcontrib><creatorcontrib>CHOI JUNG-BONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHANG KYU HWAN</au><au>CHOI JUN YOUNG</au><au>LEE YOUNG IL</au><au>KIM CHUL-GOO</au><au>CHOI JUNG-BONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING APPARATUS</title><date>2023-02-09</date><risdate>2023</risdate><abstract>To provide a substrate processing apparatus that suppresses pattern cleaning phenomenon and watermark occurrence while maintaining the mass productivity of the batch processing method.SOLUTION: A substrate processing apparatus 300 includes a processing tank 310 having a housing space 312 in which a processing solution L3 is contained to process a plurality of substrates in a liquid, and an orientation conversion member 330 that converts the posture of a substrate W immersed in the processing solution from a vertical posture to a horizontal posture. Substrates converted to the flat posture are supplied with the wetting liquid by the wetting module 350 and then processed with the liquid and dried in a single-wafer type.SELECTED DRAWING: Figure 9
【課題】バッチ式処理方法の量産性を保ちながらパターンリーニング現象やウォーターマークの発生を抑制する基板処理装置を提供する。【解決手段】基板処理装置３００は、処理液Ｌ３が収容される収容空間３１２を有して複数の基板を液処理する処理槽３１０と、処理液に浸された状態の基板Ｗの姿勢を垂直姿勢から水平姿勢に変換する姿勢変換部材３３０と、を含む。平姿勢に変換された基板は、ウェッティングモジュール３５０によりウェッティング液を供給された後、枚葉式で液処理及び乾燥処理される。【選択図】図９</abstract><oa>free_for_read</oa></addata></record> |
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| title | SUBSTRATE PROCESSING APPARATUS |
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