SUBSTRATE PROCESSING APPARATUS

To provide a substrate processing apparatus that suppresses pattern cleaning phenomenon and watermark occurrence while maintaining the mass productivity of the batch processing method.SOLUTION: A substrate processing apparatus 300 includes a processing tank 310 having a housing space 312 in which a...

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Bibliographische Detailangaben
Hauptverfasser: CHANG KYU HWAN, CHOI JUN YOUNG, LEE YOUNG IL, KIM CHUL-GOO, CHOI JUNG-BONG
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a substrate processing apparatus that suppresses pattern cleaning phenomenon and watermark occurrence while maintaining the mass productivity of the batch processing method.SOLUTION: A substrate processing apparatus 300 includes a processing tank 310 having a housing space 312 in which a processing solution L3 is contained to process a plurality of substrates in a liquid, and an orientation conversion member 330 that converts the posture of a substrate W immersed in the processing solution from a vertical posture to a horizontal posture. Substrates converted to the flat posture are supplied with the wetting liquid by the wetting module 350 and then processed with the liquid and dried in a single-wafer type.SELECTED DRAWING: Figure 9 【課題】バッチ式処理方法の量産性を保ちながらパターンリーニング現象やウォーターマークの発生を抑制する基板処理装置を提供する。【解決手段】基板処理装置300は、処理液L3が収容される収容空間312を有して複数の基板を液処理する処理槽310と、処理液に浸された状態の基板Wの姿勢を垂直姿勢から水平姿勢に変換する姿勢変換部材330と、を含む。平姿勢に変換された基板は、ウェッティングモジュール350によりウェッティング液を供給された後、枚葉式で液処理及び乾燥処理される。【選択図】図9