HEAD SUSPENSION ASSEMBLY AND DISC DEVICE

To provide a head suspension assembly and a disc device in which electrode short circuit is controlled to improve electric connection reliability.SOLUTION: According to an embodiment, a head suspension assembly includes: a support plate; a wiring member 40 which is set on the support plate; a head w...

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Hauptverfasser: SUZUKI YASUO, KIDO TAKUMA
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a head suspension assembly and a disc device in which electrode short circuit is controlled to improve electric connection reliability.SOLUTION: According to an embodiment, a head suspension assembly includes: a support plate; a wiring member 40 which is set on the support plate; a head which is mounted on the wiring member; and a piezo electric element 50 which is mounted on the wiring member. The wiring member includes: a metal plate 44a which is fixed on the support plate; a base insulation layer 44b; a first connection pad which is laminated on the base insulation layer; a second connection pad 70b; a conducting layer 44c which is formed with a plurality of wires; and a cover insulation layer 44b which is laminated on the conducting layer. The base insulation layer has a first recess HE2 which is formed in a region opposing an end part of the piezo electric element near the second connection pad, and the cover insulation layer has: a recess which is recessed along the first recess; and an opening part OP1 which is provided on the recess. The piezo electric element is connected to the second connection pad with a conductive adhesive material Ad, and a part of the conductive adhesive material is filled in the recess and the opening part of the cover insulation layer.SELECTED DRAWING: Figure 8 【課題】電極の短絡を抑制し、電気的接続の信頼性が向上したヘッドサスペンションアッセンブリおよびディスク装置を提供することにある。【解決手段】実施形態によれば、ヘッドサスペンションアッセンブリは、支持板と、支持板上に設置された配線部材40と、配線部材に実装されたヘッドと、配線部材に実装された圧電素子50と、を備えている。配線部材は、支持板に固定された金属板44aと、ベース絶縁層44bと、ベース絶縁層に積層され第1接続パッド、第2接続パッド70b、複数の配線を形成した導電層44cと、導電層に積層されたカバー絶縁層44dと、を備えている。ベース絶縁層は、第2接続パッドの近傍で圧電素子の端部に対向する領域に形成された第1凹所HE2を有し、カバー絶縁層は、第1凹所に沿って凹んだ凹所と凹所に設けられた開口部OP1とを有している。圧電素子は、導電性接着材料Adにより第2接続パッドに接続され、導電性接着材料の一部は、カバー絶縁層の凹所および開口部に充填されている。【選択図】図8