CONDUCTIVE RESIN COMPOSITION

To provide a conductive resin composition that enables formation of a conductive film, which has low volume resistivity and good conductivity, excellent adhesion to various base materials, good film hardness and flexibility, excellent solder suitability such as solder wettability and solder corrosion property, reduced short circuit failures by elution metal ions and excellent migration property, is excellent in storage stability, facilitates manufacture, does not contain a lead component, and is useful as conductive ink and a circuit connection material.SOLUTION: A conductive resin composition contains (a) silver coat copper powder, (b) an epoxy resin, (c) at least one selected from an amine-based curing agent, an acid anhydride-based curing agent, a thiol-based curing agent and a phenolic curing agent as a curing agent, and (d) a solvent.SELECTED DRAWING: None 【課題】体積抵抗率が低く良好な導電性を示し、各種基材に対する密着性に優れ、膜の硬度及び耐屈曲性が良好であり、はんだ濡れ性やはんだ食われ性等のはんだ付け適性に優れ、溶出金属イオンによる短絡故障が低減された耐マイグレーション性に優れた導電膜を形成することができ、保存安定性に優れ、製造が容易であり、鉛成分を含まず、導電性インクや回路接続材料等として有用な導電性樹脂組成物を提供すること。【解決手段】（ａ）銀コート銅粉末、（ｂ）エポキシ樹脂、（ｃ）硬化剤としてアミン系硬化剤、酸無水物系硬化剤、チオール系硬化剤及びフェノール系硬化剤から選ばれる少なくとも１種、及び（ｄ）溶媒、を含む、導電性樹脂組成物。【選択図】なし