PRODUCTION METHOD FOR RESIN BONDED BODY AND PRODUCTION DEVICE FOR RESIN BONDED BODY

To provide a production method and production device for a resin bonded body having little warpage and high bonding strength.SOLUTION: There is provided a production method for a resin bonded body in which a first resin member and a second resin member are directly bonded. The method comprises: a su...

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Bibliographische Detailangaben
Hauptverfasser:	YAMASHITA YUSUKE, TONAI SHUNPEI, KANASUGI KAZUYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	To provide a production method and production device for a resin bonded body having little warpage and high bonding strength.SOLUTION: There is provided a production method for a resin bonded body in which a first resin member and a second resin member are directly bonded. The method comprises: a surface treatment step of activating bonding surfaces of the first resin member and/or the second resin member; a bonding step of, after the surface treatment step, bonding the first resin member and the second resin member with their surfaces to be bonded in contact with each other to form a resin bonded body; and a thermal diffusion step of, after the bonding step, heating the resin bonded body. A temperature of the resin bonded body in the thermal diffusion step is adjusted to be higher than a higher one of temperatures of the first resin member and the second resin member in the bonding step.SELECTED DRAWING: Figure 1 【課題】反りが少なく、高い接合力を有する樹脂接合体の製造方法および製造装置を提供する。【解決手段】本発明は、第１の樹脂部材と第２の樹脂部材とが直接接合された樹脂接合体の製造方法であって、第１の樹脂部材および／または第２の樹脂部材の接合する面を活性化させる表面処理工程と、表面処理工程の後、第１の樹脂部材と第２の樹脂部材を、それぞれの接合する面を接触させて貼り合わせて樹脂接合体とする接合工程と、接合工程の後、樹脂接合体を加熱する熱拡散工程とを有し、熱拡散工程における樹脂接合体の温度を、接合工程における第１の樹脂部材と第２の樹脂部材の温度のうち、高い方の温度よりも高くする。【選択図】図１