ADHESIVE TAPE FOR ELECTRONIC COMPONENT
To provide an adhesive tape for electronic components capable of enough tracking and adhering to even a thick and hard wafer with a rough surface and well dicing the wafer into chips by expanding the adhesive tape for electronic components.SOLUTION: An adhesive tape 1 for electronic components has a...
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| creator | OKAMOTO MASANAO MATSUBARA YUKIHIRO |
| description | To provide an adhesive tape for electronic components capable of enough tracking and adhering to even a thick and hard wafer with a rough surface and well dicing the wafer into chips by expanding the adhesive tape for electronic components.SOLUTION: An adhesive tape 1 for electronic components has an adhesive layer 3 formed on at least one surface of a substrate film 2. The adhesive tape 1 has a stress monotonously increased to a fracture point and a stress of 11.0 MPa or more in 20% expansion when expanded in the MD direction. The adhesive tape 1 has a stress of 9.0 MPa or more in 20% expansion when expanded in the TD direction. The adhesive layer 3 has a thickness of 30-70 μm.SELECTED DRAWING: Figure 1
【課題】表面に段差を有する厚くて硬いウエハであっても、電子部品用粘着テープを十分に追従させて貼合することができ、電子部品用粘着テープをエキスパンドさせることにより、ウエハをチップ状に良好に分断することができる電子部品用粘着テープを提供する。【解決手段】基材フィルム２の少なくとも片面に粘着剤層３が形成された電子部品用粘着テープ１であって、ＭＤ方向に伸長したときに、応力が破断点まで単調増加し、２０％伸長時の応力が１１．０ＭＰａ以上であり、ＴＤ方向に伸長したときに、２０％伸長時の応力が９．０Ｍｐａ以上であり、粘着剤層３の厚みが、３０～７０μｍであることを特徴とする。【選択図】図１ |
| format | Patent |
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【課題】表面に段差を有する厚くて硬いウエハであっても、電子部品用粘着テープを十分に追従させて貼合することができ、電子部品用粘着テープをエキスパンドさせることにより、ウエハをチップ状に良好に分断することができる電子部品用粘着テープを提供する。【解決手段】基材フィルム２の少なくとも片面に粘着剤層３が形成された電子部品用粘着テープ１であって、ＭＤ方向に伸長したときに、応力が破断点まで単調増加し、２０％伸長時の応力が１１．０ＭＰａ以上であり、ＴＤ方向に伸長したときに、２０％伸長時の応力が９．０Ｍｐａ以上であり、粘着剤層３の厚みが、３０～７０μｍであることを特徴とする。【選択図】図１</description><language>eng ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230126&DB=EPODOC&CC=JP&NR=2023013023A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230126&DB=EPODOC&CC=JP&NR=2023013023A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKAMOTO MASANAO</creatorcontrib><creatorcontrib>MATSUBARA YUKIHIRO</creatorcontrib><title>ADHESIVE TAPE FOR ELECTRONIC COMPONENT</title><description>To provide an adhesive tape for electronic components capable of enough tracking and adhering to even a thick and hard wafer with a rough surface and well dicing the wafer into chips by expanding the adhesive tape for electronic components.SOLUTION: An adhesive tape 1 for electronic components has an adhesive layer 3 formed on at least one surface of a substrate film 2. The adhesive tape 1 has a stress monotonously increased to a fracture point and a stress of 11.0 MPa or more in 20% expansion when expanded in the MD direction. The adhesive tape 1 has a stress of 9.0 MPa or more in 20% expansion when expanded in the TD direction. The adhesive layer 3 has a thickness of 30-70 μm.SELECTED DRAWING: Figure 1
【課題】表面に段差を有する厚くて硬いウエハであっても、電子部品用粘着テープを十分に追従させて貼合することができ、電子部品用粘着テープをエキスパンドさせることにより、ウエハをチップ状に良好に分断することができる電子部品用粘着テープを提供する。【解決手段】基材フィルム２の少なくとも片面に粘着剤層３が形成された電子部品用粘着テープ１であって、ＭＤ方向に伸長したときに、応力が破断点まで単調増加し、２０％伸長時の応力が１１．０ＭＰａ以上であり、ＴＤ方向に伸長したときに、２０％伸長時の応力が９．０Ｍｐａ以上であり、粘着剤層３の厚みが、３０～７０μｍであることを特徴とする。【選択図】図１</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBzdPFwDfYMc1UIcQxwVXDzD1Jw9XF1Dgny9_N0VnD29w3w93P1C-FhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRsYGhsZA0tGYKEUA_wgj1g</recordid><startdate>20230126</startdate><enddate>20230126</enddate><creator>OKAMOTO MASANAO</creator><creator>MATSUBARA YUKIHIRO</creator><scope>EVB</scope></search><sort><creationdate>20230126</creationdate><title>ADHESIVE TAPE FOR ELECTRONIC COMPONENT</title><author>OKAMOTO MASANAO ; MATSUBARA YUKIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023013023A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>OKAMOTO MASANAO</creatorcontrib><creatorcontrib>MATSUBARA YUKIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OKAMOTO MASANAO</au><au>MATSUBARA YUKIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADHESIVE TAPE FOR ELECTRONIC COMPONENT</title><date>2023-01-26</date><risdate>2023</risdate><abstract>To provide an adhesive tape for electronic components capable of enough tracking and adhering to even a thick and hard wafer with a rough surface and well dicing the wafer into chips by expanding the adhesive tape for electronic components.SOLUTION: An adhesive tape 1 for electronic components has an adhesive layer 3 formed on at least one surface of a substrate film 2. The adhesive tape 1 has a stress monotonously increased to a fracture point and a stress of 11.0 MPa or more in 20% expansion when expanded in the MD direction. The adhesive tape 1 has a stress of 9.0 MPa or more in 20% expansion when expanded in the TD direction. The adhesive layer 3 has a thickness of 30-70 μm.SELECTED DRAWING: Figure 1
【課題】表面に段差を有する厚くて硬いウエハであっても、電子部品用粘着テープを十分に追従させて貼合することができ、電子部品用粘着テープをエキスパンドさせることにより、ウエハをチップ状に良好に分断することができる電子部品用粘着テープを提供する。【解決手段】基材フィルム２の少なくとも片面に粘着剤層３が形成された電子部品用粘着テープ１であって、ＭＤ方向に伸長したときに、応力が破断点まで単調増加し、２０％伸長時の応力が１１．０ＭＰａ以上であり、ＴＤ方向に伸長したときに、２０％伸長時の応力が９．０Ｍｐａ以上であり、粘着剤層３の厚みが、３０～７０μｍであることを特徴とする。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | ADHESIVE TAPE FOR ELECTRONIC COMPONENT |
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