SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

To provide a sealing resin composition which is excellent in concealment property and visibility of printing by a laser marking method.SOLUTION: A sealing resin composition contains an epoxy resin, a curing agent, an inorganic filler and a coloring agent, is formed into a cured product with a thickn...

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Bibliographische Detailangaben
Hauptverfasser:	FUSUMADA MITSUAKI, NEGORO SHUHEI, SAITO TAKESHI, KAMIMURA KAZUYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a sealing resin composition which is excellent in concealment property and visibility of printing by a laser marking method.SOLUTION: A sealing resin composition contains an epoxy resin, a curing agent, an inorganic filler and a coloring agent, is formed into a cured product with a thickness of 60 μm, and has a color difference ΔE0 from a coordinate (L=0, a=0 and b=0) in a CIE 1976 (L, a* and b*) color space on the surface of the cured product of 36 or less.SELECTED DRAWING: None 【課題】隠蔽性及びレーザーマーキング法による印字の視認性に優れる封止樹脂組成物を提供すること。【解決手段】封止樹脂組成物は、エポキシ樹脂と、硬化剤と、無機充填材と、着色剤とを含有し、厚みが６０μｍの硬化物としたときに、前記硬化物の表面におけるＣＩＥ１９７６（Ｌ＊、ａ＊、ｂ＊）色空間における座標（Ｌ＊＝０、ａ＊＝０、ｂ＊＝０）との色差ΔＥ０が、３６以下であるものである。【選択図】なし