APPARATUS FOR HEATING AND MOLDING RESIN, AND METHOD FOR CONTROLLING THE SAME
To provide an apparatus for heating and molding resin, and a method for controlling the same, which can produce a resin molded product with higher precision under a stable production system by suppressing the amount of waste thermoplastic resin material, even when a work (thermoplastic resin materia...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide an apparatus for heating and molding resin, and a method for controlling the same, which can produce a resin molded product with higher precision under a stable production system by suppressing the amount of waste thermoplastic resin material, even when a work (thermoplastic resin material) smaller in size than a die is heated and molded by a metal mold.SOLUTION: In an apparatus for heating and molding resin, a clamp is provided so as to be able to hold the end of a flat plate-shaped work, and a control unit controls the clamp at a die matching position where the work is placed on a lower die correspondingly to the die matching of an upper die. The bottom of the drooping portion of the work held by the clamp is supported by the contact of the lower die, which rises toward the upper die, then at the supported state position of the lower die, the work is released from the clamp. The supported state position is the position where the condition that a ratio S2/S1 has reached a condition that at least 5% is satisfied, where S1 represents an effective contact area of the work that can make contact with the top surface of the lower die (while the work clamping is released), and S2 represents a contact area projected onto the lower die side of the area where the bottom of the drooping portion is in contact with the lower die.SELECTED DRAWING: Figure 8
【課題】金型より小さいサイズのワーク(熱可塑性樹脂材)を、金型で加熱成形する場合でも、熱可塑性樹脂材の廃棄処分量を抑制して、より高精度な樹脂成形品を安定した生産体制で製造することができる樹脂加熱成形装置、及びその制御方法を提供する。【解決手段】樹脂加熱成形装置では、クランプは、平板状のワークの端部を保持可能に設けられ、制御部は、上型との型合わせに対応させて下型上に載置する型合わせ位置で、クランプで保持した状態のワークに対し、垂れ下がった垂下部の底を、上型に向けて上昇する下型の当接で、支えた状態となった下型の支持状態位置で、クランプによるワークの把持を解除する。支持状態位置は、下型の上面と接触可能なワークの有効接触面積S1のうち、下型と接触する垂下部の底に対し、下型側に投影される垂下部の底の投影接触面積S2を占める割合S2/S1が、少なくとも5%の条件を満たす状態に到達した位置である。【選択図】 図8 |
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