PLASMA PROCESSING APPARATUS AND LINER ASSEMBLY
To provide a conductive liner with high degree-of-freedom in a plasma processing apparatus.SOLUTION: A plasma processing apparatus comprises: a conductive chamber that includes a plasma processing space and is connected to a ground potential; a plasma generation part that is configured to generate p...
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Zusammenfassung: | To provide a conductive liner with high degree-of-freedom in a plasma processing apparatus.SOLUTION: A plasma processing apparatus comprises: a conductive chamber that includes a plasma processing space and is connected to a ground potential; a plasma generation part that is configured to generate plasma in the plasma processing space; a conductive ring that is attached to the conductive chamber in a state of being separated from the plasma processing space, and is connected to the ground potential via the conductive chamber; and a plurality of conductive liners attached to the conductive ring, and arranged in parallel in a peripheral direction of the conductive ring in the plasma processing space, in which each conductive liner includes a first surface and a second surface opposite to the first surface, and the first surface is exposed to plasma and the second surface is opposite to a side wall of the conductive chamber, and a gap is formed between two adjacent conductive liners of the plurality of conductive liners.SELECTED DRAWING: Figure 4
【課題】プラズマ処理装置において自由度の高い導電性ライナを提供する。【解決手段】プラズマ処理装置は、プラズマ処理空間を有し、グランド電位に接続される導電性チャンバと、プラズマ処理空間内でプラズマを生成するように構成されるプラズマ生成部と、プラズマ処理空間から分離した状態で導電性チャンバに取り付けられ、導電性チャンバを介してグランド電位に接続される導電性リングと、導電性リングに取り付けられ、プラズマ処理空間において導電性リングの周方向に並べて配置される複数の導電性ライナであり、各導電性ライナは、第1の面と第1の面と反対側の第2の面とを有し、第1の面は、プラズマに曝され、第2の面は、導電性チャンバの側壁と対向し、複数の導電性ライナのうち2つの隣り合う導電性ライナの間には間隙が形成されている、複数の導電性ライナと、を有する。【選択図】図4 |
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