GOLD ELECTROPLATING BATH

To realize gold electroplating bath in which a gold plating film with small surface roughness and low altitude can be obtained.SOLUTION: The gold electroplating bath contains a sulfurous acid gold salt, which is a supply source of a gold ion, conductive salt, a crystal regulator, and hardness inhibi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MARUO YOICHI, SUGIURA AKINORI, KISO MASAYUKI, HASHIMOTO DAISUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To realize gold electroplating bath in which a gold plating film with small surface roughness and low altitude can be obtained.SOLUTION: The gold electroplating bath contains a sulfurous acid gold salt, which is a supply source of a gold ion, conductive salt, a crystal regulator, and hardness inhibitor represented by the following formula (1) where R1 and R4 are a hydroxy group and R2 and R3 are each independently hydrogen or a hydroxy group.SELECTED DRAWING: None 【課題】表面粗さが小さく且つ低高度の金めっき皮膜が得られる電解金めっき浴を実現できるようにする。【解決手段】電解金めっき浴は、金イオンの供給源である亜硫酸金塩と、電導塩と、結晶調整剤と、以下の式（１）に示す硬度抑制剤とを含む。但し、Ｒ1及びＲ4は水酸基であり、Ｒ2及びＲ3はそれぞれ独立して水素又は水酸基である。【化１】TIFF2023006020000004.tif36170【選択図】なし