SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

To suppress an increase in a footprint with a plurality of processing space usable.SOLUTION: A substrate processing apparatus includes: a mounting table for supporting a substrate carried in through a transfer chamber; a plurality of processing spaces provided in the vertical direction and supplied...

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Bibliographische Detailangaben
1. Verfasser:	ASHIZAWA HIROAKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To suppress an increase in a footprint with a plurality of processing space usable.SOLUTION: A substrate processing apparatus includes: a mounting table for supporting a substrate carried in through a transfer chamber; a plurality of processing spaces provided in the vertical direction and supplied with reaction gases; and a drive mechanism that is provided under the transfer chamber and moves the mounting table so that a substrate is positioned in at least one of the plurality of processing spaces.SELECTED DRAWING: Figure 1 【課題】複数の処理空間の使用を可能にしつつフットプリントの増加を抑制する。【解決手段】基板処理装置は、搬送室を介して搬入された基板を支持する載置台と、上下方向に設けられ反応ガスが供給される複数の処理空間と、搬送室の下方に設けられ、複数の処理空間のうちの少なくとも１つの処理空間内に基板が位置するように、載置台を移動させる駆動機構と、を備える。【選択図】図１