POLYAMIDE IMIDE FILM

To provide a polyamide imide (PAI) film that can be used as an insulation film, such as a flexible wiring board, and achieve both of high tensile elasticity and a low haze value.SOLUTION: A PAI film has tensile elasticity of 4.0 GPa or more and a haze value of 2.0% or less. The PAI film can be forme...

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Bibliographische Detailangaben
Hauptverfasser: YOSHINO FUMIKO, MORIKITA TATSUYA, SHIBATA KENTA, ECHIGO YOSHIAKI, YAMADA MUNENORI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a polyamide imide (PAI) film that can be used as an insulation film, such as a flexible wiring board, and achieve both of high tensile elasticity and a low haze value.SOLUTION: A PAI film has tensile elasticity of 4.0 GPa or more and a haze value of 2.0% or less. The PAI film can be formed by, for example, preparing a PAI solution and then molding the PAI solution into a film. The PAI solution is preferably formed by subjecting trimellitic acid anhydride (TMA) and dimer acid (DA), and o-tolidine diisocyanate (TODI), which are substantially equal in mol, to polymerization in a solvent.SELECTED DRAWING: None 【課題】フレキシブル配線板等の絶縁フィルムとして用いることのできる、高引張弾性率と低ヘイズ値とが両立したポリアミドイミド(PAI)フィルムの提供。【解決手段】引張弾性率が4.0GPa以上、ヘイズ値が2.0%以下であることを特徴とするPAIフィルム。PAIフィルムは、例えば、PAI溶液を得た後、これをフィルム状に成形することにより得ることができる。PAI溶液は、略等モルの、トリメリット酸無水物(TMA)およびダイマー酸(DA)と、o-トリジンジイソシアネート(TODI)とを、溶媒中、重合反応させて得ることが好ましい。【選択図】なし