ELECTRONIC MODULE AND METHOD FOR MANUFACTURING THE SAME

To reduce the amount of adhesive material protruding from the element substrate and to provide a high-resolution imaging device with multiple electronic modules arranged at narrow intervals.SOLUTION: A method for manufacturing an electronic module 500 having an element substrate 100 with an adhesive...

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1. Verfasser: TSUKANO JUN
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To reduce the amount of adhesive material protruding from the element substrate and to provide a high-resolution imaging device with multiple electronic modules arranged at narrow intervals.SOLUTION: A method for manufacturing an electronic module 500 having an element substrate 100 with an adhesive member 300 and a support substrate 200, comprises a process of bonding the element substrate 100 and the support substrate 200 with the adhesive member 300. A portion of the adhesive member 300 undergoes a first curing process prior to the process of bonding the element substrate 100 and the support substrate 200 with the adhesive member 300. The adhesive members 300, except for some, do not undergo the first curing process, but have a second curing process after the process of bonding.SELECTED DRAWING: Figure 2 【課題】素子基板からの接着部材のはみ出し量を低減し、複数の電子モジュールを狭間隔で並べた高解像度の撮像装置を提供する。【解決手段】接着部材300を有する素子基板100と、支持基板200とを有する電子モジュール500の製造方法であって、素子基板100と支持基板200とを接着部材300で接着する工程を含む。接着部材300の一部は、素子基板100と支持基板200とを接着部材300で接着する工程の前に第一の硬化工程を経る。一部を除いた接着部材300は、第一の硬化工程を経ることなく、接着する工程の後に第二の硬化工程を備える。【選択図】図2