WIRING BOARD

To provide a wiring board that includes an upper connector and an electrode pad part capable of securing adhesion even for the electrode pad part in a small area.SOLUTION: A wiring board comprises a lower connector 108 that is connected to a wiring layer 106 within the board, and an upper connector...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	SHIOMITSU KAZUHIKO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a wiring board that includes an upper connector and an electrode pad part capable of securing adhesion even for the electrode pad part in a small area.SOLUTION: A wiring board comprises a lower connector 108 that is connected to a wiring layer 106 within the board, and an upper connector 102 that is connected to the lower connector 108. The lower connector 108 has a veer part 109 that is embedded in an isolation layer 105, and an electrode pad part 104 that is formed above the isolation layer 105. The upper connector 102 is connected onto upper and lateral surfaces of the electrode pad part 104.SELECTED DRAWING: Figure 1 【課題】小面積の電極パッド部に対しても密着性を確保できる電極パッド部及び上部接続体を有する配線基板を提供することを目的とするものである。【解決手段】基板内の配線層１０６に接続された下部接続体１０８と、前記下部接続体１０８に接続した上部接続体１０２を備える配線基板において、前記下部接続体１０８は絶縁層１０５の内部に埋設されているビア部１０９と絶縁層１０５の上方に形成されている電極パッド部１０４を有し、前記上部接続体１０２は、前記電極パッド部１０４の上面および側面において接続されている配線基板である。【選択図】図1