CLEANING DEVICE

To shorten cleaning time even when many deposits adhere to the whole or a portion of a wafer.SOLUTION: By imaging the whole of a surface of a wafer 10 while rotating the wafer and making the image a band-like image 100 with the radial direction of the wafer 10 as the vertical axis and the rotation a...

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Bibliographische Detailangaben
Hauptverfasser:	TAJIRI KAZUTAKA, INAKAZU SUSUMU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To shorten cleaning time even when many deposits adhere to the whole or a portion of a wafer.SOLUTION: By imaging the whole of a surface of a wafer 10 while rotating the wafer and making the image a band-like image 100 with the radial direction of the wafer 10 as the vertical axis and the rotation angle of the wafer 10 as the transverse axis, distribution of amounts of processing chips 101-104 on the wafer 10 and positions to which the processing chips 101-104 adhere can be recognized. Therefore, a portion to which many processing chips adhere can be predominantly re-cleaned and time required for cleaning can be shortened since there is no need to re-clean the whole evenly.SELECTED DRAWING: Figure 6 【課題】ウェーハの全体又は部分に多くの付着物が付着している場合においても、洗浄時間を短縮する。【解決手段】ウェーハ１０を回転させながらその全面を撮像し、その画像を、ウェーハ１０の径方向を縦軸としウェーハ１０の回転角度を横軸とする帯状画像１００とすることで、ウェーハ１０上の加工屑１０１～１０４の量及び加工屑１０１～１０４が付着した位置の分布を認識可能とする。したがって、加工屑が多く付着している部分を重点的に再洗浄することが可能となり、全体を満遍なく再洗浄する必要がないため、洗浄に要する時間を短縮することができる。【選択図】図６