ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

To provide an electronic component capable of suppressing airtight reduction, and a method for manufacturing the same.SOLUTION: An elastic wave device 100 includes: a support substrate 10; an elastic wave element 70 provided on the support substrate 10; a frame 40 provided on the support substrate 10 so as to surround the elastic wave element 70 in a plan view; a lid 30 provided on the frame 40 so as to sandwich an air-space 20 with the support substrate 10 and for sealing the elastic wave element 70 in the air-space 20; and a protective layer 60 provided to cover a side surface 45 on the side opposite to the air-space 20 of the frame 40 and including an element constituting the support substrate 10 excluding oxygen and carbon.SELECTED DRAWING: Figure 2 【課題】気密性の低下を抑制することが可能な電子部品および電子部品の製造方法を提供すること。【解決手段】弾性波デバイス１００は、支持基板１０と、支持基板１０上に設けられる弾性波素子７０と、平面視して弾性波素子７０を囲んで支持基板１０上に設けられる枠体４０と、支持基板１０とで空隙２０を挟んで枠体４０上に設けられ、空隙２０内に弾性波素子７０を封止するリッド３０と、枠体４０の空隙２０とは反対側の側面４５を覆って設けられ、支持基板１０を構成する元素であり酸素および炭素以外である元素を含む保護層６０とを備える。【選択図】図２