LOW DIELECTRIC LOSS RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, MOLDED BODY FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE
To provide: a novel low dielectric loss resin composition which has a low coefficient of loss in a high frequency band, while being excellent in low dielectric loss characteristics; a method for producing the low dielectric loss resin composition; a molded body for high frequency devices; and a high...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide: a novel low dielectric loss resin composition which has a low coefficient of loss in a high frequency band, while being excellent in low dielectric loss characteristics; a method for producing the low dielectric loss resin composition; a molded body for high frequency devices; and a high frequency device.SOLUTION: A low dielectric loss resin composition contains at least a polymer resin and an inorganic filler. The inorganic filler contains at least one substance that is selected from the group consisting of BiF3, ZrF4, HfF4, CeF3 and K2SiF6. This low dielectric loss resin composition is applicable to a molded body for high frequency devices and a high frequency device that are used in a frequency band of 1 GHz or more.SELECTED DRAWING: None
【課題】高周波帯域に於いて損失係数が小さく、低誘電損失特性に優れた新規な低誘電損失樹脂組成物、その製造方法、高周波機器用成形体及び高周波機器を提供する。【解決手段】本発明の低誘電損失樹脂組成物は、高分子樹脂と無機充填剤とを少なくとも含む低誘電損失樹脂組成物であって、前記無機充填剤が、BiF3、ZrF4、HfF4、CeF3及びK2SiF6からなる群より選ばれる少なくとも1種を含むことを特徴とし、1GHz以上の周波数帯域で使用される高周波機器用成形体や高周波機器に適用することができる。【選択図】なし |
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