COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT AND PACKAGE BODY

To provide a cover tape for packaging an electronic component that is excellent in visually recognizing an electronic component.SOLUTION: A cover tape 1 for packaging an electronic component comprises a resin layer 2 and a heat seal layer 3 arranged on one surface side of the resin layer, where the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SUZUKI NAHO, NAGATSUKA YASUNORI, OTA YURIE, NAGAO MASAHIRO, HAGIO HIRONORI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To provide a cover tape for packaging an electronic component that is excellent in visually recognizing an electronic component.SOLUTION: A cover tape 1 for packaging an electronic component comprises a resin layer 2 and a heat seal layer 3 arranged on one surface side of the resin layer, where the heat seal layer includes ethylene-vinyl acetate-based copolymer and a phase transition temperature measured with a differential scanning calorimeter (DSC) is 50°C or higher.SELECTED DRAWING: Figure 1 【課題】電子部品の視認性に優れた電子部品包装用カバーテープを提供する。【解決手段】樹脂層2と、上記樹脂層の一方の面側に配置されたヒートシール層3と、を有する電子部品包装用カバーテープ1であって、上記ヒートシール層は、エチレン-酢酸ビニル系共重合体を含み、示差走査熱量計(DSC)により測定される相転移温度が50℃以上である、電子部品包装用カバーテープである。【選択図】図1