ACOUSTIC WAVE DEVICE

To suppress an increase in size of a device.SOLUTION: An acoustic wave device 100 includes: a support substrate 10; an acoustic wave element 50 provided on one surface of the support substrate 10; wiring 20 provided on the one surface of the support substrate 10, the wiring being electrically connec...

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1. Verfasser: ICHINOSE SATOSHI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To suppress an increase in size of a device.SOLUTION: An acoustic wave device 100 includes: a support substrate 10; an acoustic wave element 50 provided on one surface of the support substrate 10; wiring 20 provided on the one surface of the support substrate 10, the wiring being electrically connected to the acoustic wave element 50; an input terminal 14a and a ground terminal 14c provided on the other surface of the support substrate 10; via wiring 16a provided in the support substrate 10, the via wiring connecting the wiring 20 with the input terminal 14a and the ground terminal 14c; a frame body 18 provided on the one surface of the support substrate 10 along the edge of the support substrate 10, the frame body surrounding the acoustic wave element 50 and the wiring 20 in plan view; and an inductor L1 formed by a line pattern 30a that is provided along the frame body 18 on the one surface of the support substrate 10 in plan view to be located between the edge of the support substrate 10, and the acoustic wave element 50 and the wiring 20, the inductor being electrically connected to the acoustic wave element 50, and the input terminal 14a and the ground terminal 14c.SELECTED DRAWING: Figure 2 【課題】装置の大型化を抑制すること。【解決手段】弾性波デバイス100は、支持基板10と、支持基板10の一方の面上に設けられる弾性波素子50と、支持基板10の一方の面上に設けられ、弾性波素子50に電気的に接続される配線20と、支持基板10の他方の面上に設けられる入力端子14aおよびグランド端子14cと、支持基板10に設けられ、配線20と入力端子14aおよびグランド端子14cとを接続するビア配線16aと、支持基板10の一方の面上に支持基板10の端に沿って設けられ、平面視して弾性波素子50および配線20を囲む枠体18と、平面視して支持基板10の一方の面上に支持基板10の端と弾性波素子50および配線20との間に位置して枠体18に沿って設けられた線路パターン30aにより形成され、弾性波素子50と入力端子14aおよびグランド端子14cとに電気的に接続されるインダクタL1とを備える。【選択図】図2