SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
To suppress damage to substrates when transferring substrates from a batch processing section to a single substrate processing section.SOLUTION: A substrate processing method includes the following processes: immersing a plurality of substrates in a chemical solution in a batch processing section; r...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To suppress damage to substrates when transferring substrates from a batch processing section to a single substrate processing section.SOLUTION: A substrate processing method includes the following processes: immersing a plurality of substrates in a chemical solution in a batch processing section; rinsing the substrates with a rinse solution after immersion in the chemical solution in the batch processing section; replacing at least part of the rinse solution in the substrates with IPA in the batch processing section; moving the substrates to a single substrate processing section after the rinse solution is replaced with IPA; and drying the substrates in the single substrate processing section.SELECTED DRAWING: Figure 1
【課題】バッチ処理部から枚葉処理部へ基板を移動する際の基板の損傷を抑制する。【解決手段】基板処理方法は、バッチ処理部において、複数の基板を薬液に浸漬させる工程と、バッチ処理部において、薬液に浸漬された後の基板を、リンス液で洗浄する工程と、バッチ処理部において、基板におけるリンス液の少なくとも一部をIPAで置換する工程と、IPAでリンス液が置換された後の基板を、枚葉処理部へ移動させる工程と、枚葉処理部において、基板を乾燥させる工程とを備える。【選択図】図1 |
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