SUBSTRATE PRODUCING METHOD, INTERMEDIATE PRODUCT OF SUBSTRATE, AND SUBSTRATE PRODUCING DEVICE
To produce a multilayer substrate with fine wiring in a short time while enhancing a degree of freedom in design.SOLUTION: A substrate producing method includes an intermediate product manufacturing step and a substrate processing step. At the intermediate product manufacturing step, an intermediate...
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Sprache: | eng ; jpn |
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Zusammenfassung: | To produce a multilayer substrate with fine wiring in a short time while enhancing a degree of freedom in design.SOLUTION: A substrate producing method includes an intermediate product manufacturing step and a substrate processing step. At the intermediate product manufacturing step, an intermediate product of a substrate on which a part of a circuit to be mounted on the substrate and a surface electrode region to which cutting processing is to be subjected are formed is manufactured by etching. At the substrate processing step, the substrate processing machine 100 applies cutting processing to the surface electrode region of the intermediate product to form a designed circuit.SELECTED DRAWING: Figure 1
【課題】微細な配線を有する多層の基板を設計の自由度を高めつつ、短時間で作成すること。【解決手段】基板作成方法は、中間体製造工程と、基板加工工程とを含む。中間体製造工程では、エッチングを用いて、基板に実装される回路の一部及び切削加工の対象となる面電極領域が形成された基板の中間体が製造される。基板加工工程では、中間体の面電極領域に基板加工機100で切削加工を施すことにより、設計された回路が形成される。【選択図】図1 |
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