PACKAGE AND ELECTRONIC APPARATUS
To provide a package that can secure reliability on a joint between a frame body and a lid body, while enhancing heat radiation performance of a heat sink, and an electronic apparatus including the same.SOLUTION: A package 10C has a cavity CV that is sealed with a lid body 80C. The package 10C inclu...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | To provide a package that can secure reliability on a joint between a frame body and a lid body, while enhancing heat radiation performance of a heat sink, and an electronic apparatus including the same.SOLUTION: A package 10C has a cavity CV that is sealed with a lid body 80C. The package 10C includes: a heat sink 13 having a linear expansion coefficient of 9 ppm/°C or more and 15 ppm/°C or less at temperatures of 25°C-100°C; and a frame body 14C, provided on the heat sink 13 and made of ceramics, which surrounds the cavity CV in a planar view. In the planar view, an outer edge of the frame body 14C includes a first straight line portion LN1 extending along a first direction, a second straight line portion LN2 extending along a direction orthogonal to the first direction, and a chamfering portion CM1 joining the first straight line portion LN1 to the second straight line portion LN2.SELECTED DRAWING: Figure 1
【課題】ヒートシンクの放熱性を高くしつつ、枠体と蓋体との間の接合信頼性を確保することができるパッケージと、それを含む電子装置とを提供する。【解決手段】パッケージ１０Ｃは、蓋体８０Ｃによって封止されることになるキャビティＣＶを有している。パッケージ１０Ｃは、２５℃と１００℃との間で９ｐｐｍ／℃以上１５ｐｐｍ／℃以下の線膨張係数を有するヒートシンク１３と、ヒートシンク１３上に設けられ、セラミックスからなり、平面視においてキャビティＣＶを囲む枠体１４Ｃとを含む。平面視において、枠体１４Ｃの外縁は、第１方向に沿って延びる第１直線部ＬＮ１と、第１方向と直交する方向に沿って延びる第２直線部ＬＮ２と、第１直線部ＬＮ１と第２直線部ＬＮ２とをつなぐ面取り部ＣＭ１とを含む。【選択図】図１ |
|---|