ADHESIVE COMPOSITION, ADHESIVE FILM, AND METHOD FOR PRODUCING CONNECTION STRUCTURE

To provide an adhesive composition including a polyurethane amide imide resin having excellent MEK solubility and an adhesive film, and a method for producing a connection structure using the adhesive film.SOLUTION: An adhesive composition includes a polyurethane amide imide resin as a block copolym...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIBA AYUMI, IZAWA HIROYUKI, OKOSHI SHOJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide an adhesive composition including a polyurethane amide imide resin having excellent MEK solubility and an adhesive film, and a method for producing a connection structure using the adhesive film.SOLUTION: An adhesive composition includes a polyurethane amide imide resin as a block copolymer comprising a polyurethane oligomer from the reaction between a diisocyanate and a diol, which is chain-extended with a trimellitic acid anhydride. Relative to 100 pts.mass of the polyurethane amide imide resin, the MEK is 1-1000 pts.mass.SELECTED DRAWING: None 【課題】ＭＥＫ溶解性に優れたポリウレタンアミドイミド樹脂を含む接着剤組成物及び接着剤フィルム、並びに接着剤フィルムを用いる接続構造体の製造方法を提供する。【解決手段】接着剤組成物は、ジイソシアネートとジオールとの反応から得られたポリウレタンオリゴマを、トリメリット酸無水物で鎖延長したブロック共重合体であるポリウレタンアミドイミド樹脂を含み、前記接着剤組成物は、前記ポリウレタンアミドイミド樹脂１００質量部に対して、ＭＥＫを１～１０００質量部含有する。【選択図】なし