WIRING BOARD, DISPLAY, AND METHOD FOR MANUFACTURING WIRING BOARD

To reduce wiring resistance and prevent deformation of a substrate.SOLUTION: An array substrate 12 comprises: a glass substrate 12GS; a first gate wiring forming part 15A that is composed of a first metal film F1 laminated on the glass substrate 12GS and extends along a plate surface of the glass su...

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Hauptverfasser: SASAKI KAZUNARI, MATSUMOTO RYUJI, ICHIKAWA MASASHI, ITAKURA RYOJI, KAZUMI OSAMU, TERAUCHI TAKASHI, HAYASHI KIMIHIKO, MORIHIRO KAZUTOSHI
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creator SASAKI KAZUNARI
MATSUMOTO RYUJI
ICHIKAWA MASASHI
ITAKURA RYOJI
KAZUMI OSAMU
TERAUCHI TAKASHI
HAYASHI KIMIHIKO
MORIHIRO KAZUTOSHI
description To reduce wiring resistance and prevent deformation of a substrate.SOLUTION: An array substrate 12 comprises: a glass substrate 12GS; a first gate wiring forming part 15A that is composed of a first metal film F1 laminated on the glass substrate 12GS and extends along a plate surface of the glass substrate 12GS; a first insulating film F2 that is laminated at last on the glass substrate 12GS, the first insulating film F2 having a first opening F2A arranged to be superimposed on the first gate wiring forming part 15A and extending along the first gate wiring forming part 15A; and a second gate wiring forming part 15B that is composed of a second metal film F3 laminated at least on the first metal film F1, extends along the first gate wiring forming part 15A, and forms gate wiring 15 together with the first gate wiring forming part 15A, the second gate wiring forming part 15B arranged to be at least partially superimposed on the first opening F2A and in contact with the first gate wiring forming part 15A.SELECTED DRAWING: Figure 3 【課題】配線抵抗の低減を図るとともに基板の変形を抑制する。【解決手段】アレイ基板12は、ガラス基板12GSと、ガラス基板12GS上に積層される第1金属膜F1からなりガラス基板12GSの板面に沿って延在する第1ゲート配線構成部15Aと、少なくともガラス基板12GS上に積層される第1絶縁膜F2であって、第1ゲート配線構成部15Aと重畳するよう配されて第1ゲート配線構成部15Aに沿って延在する第1開口F2Aを有する第1絶縁膜F2と、少なくとも第1金属膜F1上に積層される第2金属膜F3からなり第1ゲート配線構成部15Aに沿って延在していて第1ゲート配線構成部15Aと共にゲート配線15を構成する第2ゲート配線構成部15Bであって、少なくとも一部が第1開口F2Aと重畳するよう配されて第1ゲート配線構成部15Aに接する第2ゲート配線構成部15Bと、を備える。【選択図】図3
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MORIHIRO KAZUTOSHI</creatorcontrib><description>To reduce wiring resistance and prevent deformation of a substrate.SOLUTION: An array substrate 12 comprises: a glass substrate 12GS; a first gate wiring forming part 15A that is composed of a first metal film F1 laminated on the glass substrate 12GS and extends along a plate surface of the glass substrate 12GS; a first insulating film F2 that is laminated at last on the glass substrate 12GS, the first insulating film F2 having a first opening F2A arranged to be superimposed on the first gate wiring forming part 15A and extending along the first gate wiring forming part 15A; and a second gate wiring forming part 15B that is composed of a second metal film F3 laminated at least on the first metal film F1, extends along the first gate wiring forming part 15A, and forms gate wiring 15 together with the first gate wiring forming part 15A, the second gate wiring forming part 15B arranged to be at least partially superimposed on the first opening F2A and in contact with the first gate wiring forming part 15A.SELECTED DRAWING: Figure 3 【課題】配線抵抗の低減を図るとともに基板の変形を抑制する。【解決手段】アレイ基板12は、ガラス基板12GSと、ガラス基板12GS上に積層される第1金属膜F1からなりガラス基板12GSの板面に沿って延在する第1ゲート配線構成部15Aと、少なくともガラス基板12GS上に積層される第1絶縁膜F2であって、第1ゲート配線構成部15Aと重畳するよう配されて第1ゲート配線構成部15Aに沿って延在する第1開口F2Aを有する第1絶縁膜F2と、少なくとも第1金属膜F1上に積層される第2金属膜F3からなり第1ゲート配線構成部15Aに沿って延在していて第1ゲート配線構成部15Aと共にゲート配線15を構成する第2ゲート配線構成部15Bであって、少なくとも一部が第1開口F2Aと重畳するよう配されて第1ゲート配線構成部15Aに接する第2ゲート配線構成部15Bと、を備える。【選択図】図3</description><language>eng ; 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MATSUMOTO RYUJI ; ICHIKAWA MASASHI ; ITAKURA RYOJI ; KAZUMI OSAMU ; TERAUCHI TAKASHI ; HAYASHI KIMIHIKO ; MORIHIRO KAZUTOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022168440A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>ADVERTISING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CRYPTOGRAPHY</topic><topic>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</topic><topic>DISPLAY</topic><topic>DISPLAYING</topic><topic>EDUCATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FREQUENCY-CHANGING</topic><topic>LABELS OR NAME-PLATES</topic><topic>NON-LINEAR OPTICS</topic><topic>OPTICAL ANALOGUE/DIGITAL CONVERTERS</topic><topic>OPTICAL LOGIC ELEMENTS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEALS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SIGNS</topic><topic>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</topic><toplevel>online_resources</toplevel><creatorcontrib>SASAKI KAZUNARI</creatorcontrib><creatorcontrib>MATSUMOTO RYUJI</creatorcontrib><creatorcontrib>ICHIKAWA MASASHI</creatorcontrib><creatorcontrib>ITAKURA RYOJI</creatorcontrib><creatorcontrib>KAZUMI OSAMU</creatorcontrib><creatorcontrib>TERAUCHI TAKASHI</creatorcontrib><creatorcontrib>HAYASHI KIMIHIKO</creatorcontrib><creatorcontrib>MORIHIRO KAZUTOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SASAKI KAZUNARI</au><au>MATSUMOTO RYUJI</au><au>ICHIKAWA MASASHI</au><au>ITAKURA RYOJI</au><au>KAZUMI OSAMU</au><au>TERAUCHI TAKASHI</au><au>HAYASHI KIMIHIKO</au><au>MORIHIRO KAZUTOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WIRING BOARD, DISPLAY, AND METHOD FOR MANUFACTURING WIRING BOARD</title><date>2022-11-08</date><risdate>2022</risdate><abstract>To reduce wiring resistance and prevent deformation of a substrate.SOLUTION: An array substrate 12 comprises: a glass substrate 12GS; a first gate wiring forming part 15A that is composed of a first metal film F1 laminated on the glass substrate 12GS and extends along a plate surface of the glass substrate 12GS; a first insulating film F2 that is laminated at last on the glass substrate 12GS, the first insulating film F2 having a first opening F2A arranged to be superimposed on the first gate wiring forming part 15A and extending along the first gate wiring forming part 15A; and a second gate wiring forming part 15B that is composed of a second metal film F3 laminated at least on the first metal film F1, extends along the first gate wiring forming part 15A, and forms gate wiring 15 together with the first gate wiring forming part 15A, the second gate wiring forming part 15B arranged to be at least partially superimposed on the first opening F2A and in contact with the first gate wiring forming part 15A.SELECTED DRAWING: Figure 3 【課題】配線抵抗の低減を図るとともに基板の変形を抑制する。【解決手段】アレイ基板12は、ガラス基板12GSと、ガラス基板12GS上に積層される第1金属膜F1からなりガラス基板12GSの板面に沿って延在する第1ゲート配線構成部15Aと、少なくともガラス基板12GS上に積層される第1絶縁膜F2であって、第1ゲート配線構成部15Aと重畳するよう配されて第1ゲート配線構成部15Aに沿って延在する第1開口F2Aを有する第1絶縁膜F2と、少なくとも第1金属膜F1上に積層される第2金属膜F3からなり第1ゲート配線構成部15Aに沿って延在していて第1ゲート配線構成部15Aと共にゲート配線15を構成する第2ゲート配線構成部15Bであって、少なくとも一部が第1開口F2Aと重畳するよう配されて第1ゲート配線構成部15Aに接する第2ゲート配線構成部15Bと、を備える。【選択図】図3</abstract><oa>free_for_read</oa></addata></record>
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recordid cdi_epo_espacenet_JP2022168440A
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subjects ADVERTISING
BASIC ELECTRIC ELEMENTS
CRYPTOGRAPHY
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
DISPLAY
DISPLAYING
EDUCATION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FREQUENCY-CHANGING
LABELS OR NAME-PLATES
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
SEALS
SEMICONDUCTOR DEVICES
SIGNS
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
title WIRING BOARD, DISPLAY, AND METHOD FOR MANUFACTURING WIRING BOARD
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