PLATING DEVICE WITH A PLURALITY OF PROCESSING UNITS CIRCUMFERENTIALLY ARRANGED

To provide a plating device of a simple structure, capable of transferring a wafer.SOLUTION: The plating device according to the present invention comprises a plurality of processing units 14 and transfer means 13 of transferring a wafer W to the plurality of processing units 14, in which: the trans...

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Bibliographische Detailangaben
Hauptverfasser:	IMURA FUMITO, MORISONO TETSUYA, HARA SHIRO, KUMPUAN SOMAWANG, KAMASAKI KAYO, YOSHINAGA TAKAFUMI, KIKUNO TOSHIHIRO, ISHIDA YUKI, FUKUYAMA MITSUHIKO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	To provide a plating device of a simple structure, capable of transferring a wafer.SOLUTION: The plating device according to the present invention comprises a plurality of processing units 14 and transfer means 13 of transferring a wafer W to the plurality of processing units 14, in which: the transfer means 13 comprises an arm 31 provided with a plating jig 32 for holding a wafer W at one end thereof and an arm rotating driver 33 for rotating the arm 31 on the other end thereof; and the plurality of processing units 14 are disposed on the locus of rotation of the plating jig 32 with a specified distance apart.SELECTED DRAWING: Figure 3 【課題】簡単な構成でウェハを搬送できるめっき処理装置を提供する。【解決手段】本発明は、複数の処理部１４と、ウェハＷを複数の処理部１４へ搬送する搬送手段１３と、を備え、搬送手段１３は、一端側にウェハＷを保持するめっき治具３２が設けられたアーム３１と、アーム３１を他端側を中心に回転させるアーム回転駆動部３３と、を有し、複数の処理部１４は、めっき治具３２の回動軌跡上に所定間隔を介して配置されている構成とされている。【選択図】図３