LAMINATED CURABLE RESIN STRUCTURE, DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT

To provide a laminated curable resin structure from which a cured product that has high resolution and crack resistance and excellent adhesion to metal plating can be obtained.SOLUTION: A laminated curable resin structure is composed of two resin layers in which an X layer composed of an alkali-soluble resin composition X and a Y layer composed of an alkali-soluble resin composition Y are laminated, wherein the X layer is 5% or more and 30% or less of the thickness of the total two resin layers combined with the Y layer, and in a cured product with a thickness of 20 to 30 μm by light irradiation of 1,000 mJ/cm2 and heat treatment at 160°C for one hour, a coefficient of thermal expansion at 200 to 250°C by thermomechanical analysis is 110 ppm/°C or less.SELECTED DRAWING: Figure 1 【課題】高い解像性と、クラック耐性、金属めっきとの密着性に優れた硬化物を得ることができる積層硬化性樹脂構造体を提供する。【解決手段】アルカリ可溶性樹脂組成物ＸからなるＸ層と、アルカリ可溶性樹脂組成物ＹからなるＹ層とが積層された２層の樹脂層からなり、前記Ｘ層が、前記Ｙ層と合わせた２層の樹脂層全体の厚さの５％以上３０％以下であり、１０００ｍＪ／ｃｍ２の光照射および１６０℃、１時間の熱処理による厚さ２０～３０μｍの硬化物において、熱機械分析による２００～２５０℃の熱膨張係数が１１０ｐｐｍ／℃以下である積層硬化性樹脂構造体。【選択図】図１